{"product_id":"1769-adn-allen-bradley-devicenet-communication-adapter-module","title":"1769-ADN Allen-Bradley DeviceNet Communication Adapter Module","description":"\u003ch2\u003eAllen-Bradley 1769-ADN DeviceNet Communication Adapter\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eAllen-Bradley 1769-ADN\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003e1769-ADN\u003c\/strong\u003e DeviceNet Communication Adapter, operates as a dedicated hardware component for interfacing 1769 Compact I\/O modules with distributed master controllers within DeviceNet network platforms. The module executes data packet translations using the Common Industrial Protocol (CIP) to function as a slave station on the bus, allowing remote I\/O processing without a localized CPU assembly.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1769-ADN Series A\u003c\/strong\u003e: Initial hardware revision featuring an internal backplane current draw of 450 mA at 5.1 VDC.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1769-ADN Series B\u003c\/strong\u003e: Updated hardware revision optimizing internal component architectures, featuring an increased backplane current draw of 500 mA at 5.1 VDC.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e1769-ADN\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eAllen-Bradley \/ Rockwell Automation\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.28 kg (0.61 lb)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e118 x 50 x 87 mm (H x W x D)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eDependent on Series backplane current draw\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProtocol\u003c\/td\u003e\n\u003ctd\u003eDeviceNet (CIP)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExpansion Module Capacity\u003c\/td\u003e\n\u003ctd\u003eUp to 30 modules per I\/O bank\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMemory Mapping Capacity\u003c\/td\u003e\n\u003ctd\u003e180 words Input \/ 180 words Output max\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDeviceNet Baud Rates\u003c\/td\u003e\n\u003ctd\u003e125 Kbps (500 m max), 250 Kbps (250 m max), 500 Kbps (100 m max)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackplane Current (Series A)\u003c\/td\u003e\n\u003ctd\u003e450 mA @ 5.1 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackplane Current (Series B)\u003c\/td\u003e\n\u003ctd\u003e500 mA @ 5.1 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDeviceNet Network Current Draw\u003c\/td\u003e\n\u003ctd\u003e90 mA @ 24 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation Voltage\u003c\/td\u003e\n\u003ctd\u003e30 V continuous, tested at 500 VDC for 60 s\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Humidity\u003c\/td\u003e\n\u003ctd\u003e5% to 95% non-condensing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Network and Processing Characteristics\u003c\/h3\u003e\n\u003cp\u003eThe hardware incorporates architecture optimized for real-time DeviceNet deterministic networks. The internal logic handles I\/O density scaling up to a maximum threshold of 180 input words and 180 output words, regulating data transfers between the expansion modules and the main industrial network. Firmware flash compatibility via specialized system configuration software ensures matching communication parameters and data assembly structures across the local 1769 backplane link, minimizing protocol transmission latencies.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the network baud rate configuration affect the physical physical cable distance constraints of the system? A: The hardware supports three transmission rates that dictate the maximum trunk line length. Operating at 125 Kbps allows a maximum network distance of 500 m, 250 Kbps restricts the network to 250 m, and 500 Kbps limits the physical distance to 100 m.\u003c\/p\u003e\n\u003cp\u003eQ: Can the adapter power the attached local 1769 expansion modules directly through the DeviceNet network connection? A: No, the 90 mA at 24 VDC drawn from the DeviceNet network powers only the adapter's internal communication transceiver. A separate 1769 power supply must be installed on the local backplane bank to supply the required 5.1 VDC or 24 VDC operating current to the attached expansion I\/O modules.\u003c\/p\u003e\n\u003cp\u003eQ: Is online module substitution or hot-swapping supported on the expansion bank attached to this adapter? A: No. The local backplane architecture does not support Removal and Insertion Under Power (RIUP). Main supply voltage and network power must be completely isolated before adding, removing, or swapping any I\/O module within the bank to avoid configuration corruption or hardware component damage.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eMount the communication adapter horizontally onto a standard DIN-rail assembly or securely using direct panel-mounting fasteners inside an approved industrial enclosure. Ensure a minimum layout clearance of 50 mm on all sides of the housing to prevent thermal building and keep the environment within the 0 to 60 deg C operational limits.\u003c\/p\u003e\n\u003cp\u003eThe DeviceNet open-style drop connector must be wired in strict compliance with the network color-coding standards (Red: V+, White: CAN_H, Shield: Bare, Blue: CAN_L, Black: V-). Install 121 Ohm, 0.25 W terminating resistors across the CAN_H and CAN_L lines at both physical ends of the trunk line. Ensure the network shield wire is tied to a single, high-integrity grounding source for the entire network segment to suppress signal crosstalk and common-mode electrical interference.\u003c\/p\u003e","brand":"Allen Bradley","offers":[{"title":"Default Title","offer_id":42870828105818,"sku":"1769-ADN","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/398_a4392b0c-a147-4a54-b831-4c3ea5120094.jpg?v=1772418941","url":"https:\/\/www.spareoil.com\/products\/1769-adn-allen-bradley-devicenet-communication-adapter-module","provider":"SpareOil Automation","version":"1.0","type":"link"}