{"product_id":"ds200dcpag1abb-ge-mark-v-control-processor-board","title":"DS200DCPAG1ABB GE Mark V Control Processor Board","description":"\u003cp\u003eConfigured for primary control processing and system diagnostics in Mark V turbine control platforms, the \u003cstrong\u003eGE DS200DCPAG1ABB\u003c\/strong\u003e (\u003cstrong\u003eDCPA\u003c\/strong\u003e Digital Processor Control Card) provides direct physical\/electrical execution.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200DCPAG1ABB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Industrial Systems\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.85 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Mark V PCB Form Factor\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e15 W (Nominal backplane load)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFunctional Acronym\u003c\/td\u003e\n\u003ctd\u003eDCPA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSeries\u003c\/td\u003e\n\u003ctd\u003eMark V\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAssembly Type\u003c\/td\u003e\n\u003ctd\u003eNormal Assembly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRevision Level\u003c\/td\u003e\n\u003ctd\u003eRevision G1ABB (A-rated primary, B-rated secondary, B-rated artwork)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRedundancy Modes\u003c\/td\u003e\n\u003ctd\u003eSimplex, Dual, Triple Modular Redundancy (TMR)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eComponent Profile\u003c\/td\u003e\n\u003ctd\u003e17 Integrated Circuits, 24 Resistor Networks, Metal Film Resistors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInterconnect Interface\u003c\/td\u003e\n\u003ctd\u003eVertical Pin Connectors (13 to 20 Pins)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication \u0026amp; Firmware Flash Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe DS200DCPAG1ABB communicates via the high-speed Mark V control backplane bus, managing deterministic data exchanges across dual or triple modular redundancy (TMR) bus topologies. The board architecture incorporates seventeen onboard integrated circuits and twenty-four resistor network arrays designed to maintain execution timing during inter-rack synchronization. System firmware flash compatibility ensures synchronized cycle execution between R, S, and T cores in TMR configurations, eliminating backplane bus latency and bus contention during critical turbine governing cycles. High-density edge connectors maintain backplane bus velocity while suppressing signal distortion across the local distribution bus.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How is backplane bus communication established across redundant control cores?\u003c\/p\u003e\n\u003cp\u003eA: The board utilizes vertical pin connectors (13 to 20 pins) along the side and bottom edges to mate directly with the Mark V backplane bus. In TMR configurations, state synchronization data passes deterministically across isolated backplane channels to maintain phase alignment among the three control processors.\u003c\/p\u003e\n\u003cp\u003eQ: What are the primary physical handling considerations for board replacement?\u003c\/p\u003e\n\u003cp\u003eA: Power off the rack backplane before inserting or removing the card to prevent bus disruption. Static-sensitive components, including the seventeen integrated circuits and ceramic\/axial capacitors, require ground-strap bonding to prevent electrostatic discharge (ESD) damage during hardware replacement.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eEnsure complete de-energization of the Mark V rack power distribution bus prior to card insertion or removal.\u003c\/li\u003e\n\u003cli\u003eWear an ESD grounding wrist strap attached to an unpainted metal chassis earth ground before handling the circuit card.\u003c\/li\u003e\n\u003cli\u003eAlign the board with the designated rack card guides and press firmly until all vertical pin connectors (13 to 20 pin arrays) mate completely with the backplane.\u003c\/li\u003e\n\u003cli\u003eVerify that all interconnect cables are secured without exceeding minimum bend radius constraints.\u003c\/li\u003e\n\u003cli\u003eApply power to the rack and verify that board diagnostics successfully complete self-test validation before placing the system into auto-execution mode.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":43903981715546,"sku":"DS200DCPAG1ABB","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/DS200DCPAG1ABB.png?v=1787645986","url":"https:\/\/www.spareoil.com\/products\/ds200dcpag1abb-ge-mark-v-control-processor-board","provider":"SpareOil Automation","version":"1.0","type":"link"}