{"product_id":"ds200ldccg1ada-ge-drive-control-lan-communications-board","title":"DS200LDCCG1ADA GE Drive Control\/LAN Communications Board","description":"\u003cp\u003eConfigured for multi-processor signal processing and network bus conversion in GE Mark V Speedtronic and DIRECTO-MATIC 2000 systems, the \u003cstrong\u003eGE DS200LDCCG1ADA\u003c\/strong\u003e (\u003cstrong\u003eLDCC\u003c\/strong\u003e Drive Control\/LAN Communications Board) provides direct physical\/electrical execution.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eRevision Component\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eDesignator Code\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eDescription\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eBase PCB Architecture\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDS200\u003c\/td\u003e\n\u003ctd\u003eStandard GE Mark V form factor circuit board baseline\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Acronym\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eLDCC\u003c\/td\u003e\n\u003ctd\u003eDrive Control and LAN Communications Board\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eCoating Variant\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eG\u003c\/td\u003e\n\u003ctd\u003eNormal (standard) protective PCB coating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003e1st Functional Revision\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eA\u003c\/td\u003e\n\u003ctd\u003eInitial functional design revision\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003e2nd Functional Revision\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eD\u003c\/td\u003e\n\u003ctd\u003eSecondary functional design modification\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eArtwork Revision\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eA\u003c\/td\u003e\n\u003ctd\u003eBase circuit trace and silkscreen artwork revision\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eModel\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDS200LDCCG1ADA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eBrand\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGE (General Electric)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOrigin\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOperating Temp\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePower Consumption\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eInternal backplane DC power supplied\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eProduct Series\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eSpeedtronic Mark V \/ DIRECTO-MATIC 2000\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eProcessing Architecture\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eQuad-processor array (DCP, MCP, CMP, LCP)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eCoating Type\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eNormal Coating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eInstruction Manual\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGEI-100216\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eIndustrial Control \u0026amp; Processing Dynamics\u003c\/h3\u003e\n\u003cp\u003eThe DS200LDCCG1ADA leverages an integrated quad-processor architecture to ensure backplane bus communication velocity and real-time processing execution. Drive control tasks are partitioned across the Drive Control Processor (DCP) for peripheral I\/O processing and signal conversion, the Motor Control Processor (MCP) for digital loop execution, and the Co-Motor Processor (CMP) for processing complex mathematical algorithms. Network interfacing is managed independently by the LAN Control Processor (LCP), maintaining firmware flash compatibility and deterministic network throughput across connected DIRECTO-MATIC 2000 drive nodes.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the Co-Motor Processor (CMP) interact with the Motor Control Processor (MCP) during operation?\u003c\/p\u003e\n\u003cp\u003eA: The CMP acts as a math coprocessor to offload advanced math calculations from the primary MCP, maintaining execution timing for complex motor control loops without overloading main processing routines.\u003c\/p\u003e\n\u003cp\u003eQ: What network tasks are offloaded to the LAN Control Processor (LCP)?\u003c\/p\u003e\n\u003cp\u003eA: The LCP handles all protocol translations and message formatting required to interface the card with local area network buses, insulating drive control tasks from communication traffic overhead.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003ePower down the drive cabinet completely and discharge all DC bus capacitors prior to handling the circuit board.\u003c\/li\u003e\n\u003cli\u003eWear an ESD grounding strap attached to an unpainted metal surface on the enclosure framework before removing the card from its protective bag.\u003c\/li\u003e\n\u003cli\u003eVerify onboard jumper configuration settings against system schematic documentation before inserting the card into the rack.\u003c\/li\u003e\n\u003cli\u003eAlign the board edges with the enclosure card guides and press firmly until the edge connectors seat completely into the backplane socket.\u003c\/li\u003e\n\u003cli\u003eEnsure all wiring shield drain wires are terminated directly to the cabinet earth ground bus using low-impedance connection points.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43874327363674,"sku":"DS200LDCCG1ADA","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/DS200LDCCH1ALA_962f4827-7ed8-4965-82f5-d7d36794509d.png?v=1787212713","url":"https:\/\/www.spareoil.com\/products\/ds200ldccg1ada-ge-drive-control-lan-communications-board","provider":"SpareOil Automation","version":"1.0","type":"link"}