{"product_id":"ds200ldcch1aga-ge-drive-control-board-new-original-stock","title":"DS200LDCCH1AGA GE Drive Control Board | New \u0026 Original Stock","description":"\u003ch2\u003eGE DS200LDCCH1AGA Mark V Drive Control and LAN Communications Board\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE DS200LDCCH1AGA\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDS200LDCC\u003c\/strong\u003e Drive Control Board Module, operates as a dedicated hardware component for real-time I\/O processing, system iagnostics, and peripheral board interfacing within Mark V Speedtronic networks.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDS200\u003c\/strong\u003e : Base system circuit board design platform for the Mark V control rack architecture.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLDCC\u003c\/strong\u003e : Drive Control and LAN Communications Board functional layout.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eH1\u003c\/strong\u003e : High-density integration revision variant featuring a 7-layer PCB construction.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eA\u003c\/strong\u003e : Functional engineering release version.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eG\u003c\/strong\u003e : Manufacturing tracking code designation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eA\u003c\/strong\u003e : Base configuration component bill of materials pattern.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"1\"\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd data-row=\"1\"\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"2\"\u003eModel\u003c\/td\u003e\n\u003ctd data-row=\"2\"\u003eDS200LDCCH1AGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"3\"\u003eBrand\u003c\/td\u003e\n\u003ctd data-row=\"3\"\u003eGeneral Electric (GE)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"4\"\u003eOrigin\u003c\/td\u003e\n\u003ctd data-row=\"4\"\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"5\"\u003eWeight\u003c\/td\u003e\n\u003ctd data-row=\"5\"\u003e1.2 kg maximum with protective shipping packaging\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"6\"\u003eDimensions\u003c\/td\u003e\n\u003ctd data-row=\"6\"\u003e27.8 x 15.5 x 4.0 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"7\"\u003eOperating Temp\u003c\/td\u003e\n\u003ctd data-row=\"7\"\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"8\"\u003ePower Consumption\u003c\/td\u003e\n\u003ctd data-row=\"8\"\u003e22 W maximum derived from backplane interface\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"9\"\u003eProcessing Architecture\u003c\/td\u003e\n\u003ctd data-row=\"9\"\u003e4 onboard co-processors for concurrent task distribution\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"10\"\u003eInput Configuration\u003c\/td\u003e\n\u003ctd data-row=\"10\"\u003e24 dry-contact discrete inputs (Input-only topology)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"11\"\u003eSignal Isolation\u003c\/td\u003e\n\u003ctd data-row=\"11\"\u003eOpto-isolation between field-side connections and core logic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"12\"\u003eCustomization Options\u003c\/td\u003e\n\u003ctd data-row=\"12\"\u003e14 user-configurable manual hardware jumper sets\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd data-row=\"13\"\u003eMemory Configuration\u003c\/td\u003e\n\u003ctd data-row=\"13\"\u003eIntegrated EPROM sockets for firmware storage and volatile RAM\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eFirmware Flash Compatibility and Deterministic Bus Communication\u003c\/h3\u003e\n\u003cp\u003eThe board routes processing tasks concurrently across its 4 onboard microprocessors to sustain deterministic data throughput over local area network (LAN) connections and proprietary backplane bus structures. To ensure stable operational timing loops and avoid communication framing fault codes, the integrated EPROM memory chips must align with the exact firmware flash compatibility baseline designated for the master Mark V control subsystem. The 7-layer circuit board design layout provides high noise immunity, allowing the high-density input logic to feed status changes back to the system core without introducing bus cycle jitter or transmission latencies.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the DS200LDCCH1AGA design accommodate on-line hot-swap replacement routines during turbine operation?\u003c\/p\u003e\n\u003cp\u003eA: No. Removing or inserting this drive control module while the system backplane is energized will disrupt active communication links, interrupt the master control algorithms, and induce an immediate system trip response.\u003c\/p\u003e\n\u003cp\u003eQ: How do the 14 onboard hardware jumpers affect system parameter programming?\u003c\/p\u003e\n\u003cp\u003eA: The jumpers do not modify software parameters. They dictate physical field signal routing, impedance matching, and backplane configuration choices before power is applied to the board assembly as detailed in documentation reference GEI-100216.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eSecure the 27.8 x 15.5 x 4.0 cm circuit card to its designated metal tracking rails inside the Mark V control enclosure using appropriate anti-static positioning clips.\u003c\/li\u003e\n\u003cli\u003eAlign and configure all 14 manual hardware jumpers strictly to the engineering schematic requirements prior to making electrical connections.\u003c\/li\u003e\n\u003cli\u003eRoute the 24 dry-contact field wiring lines completely away from high-voltage AC motor power cables to suppress inductive noise coupling across the inputs.\u003c\/li\u003e\n\u003cli\u003eEnsure all proprietary ribbon cable bus connectors are seated evenly into their corresponding headers and that the mechanical retaining latches are fully locked.\u003c\/li\u003e\n\u003cli\u003eGround the system enclosures and cable shield terminations to low-resistance grounding bars to keep the opto-isolation circuitry operating within nominal protection limits.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":42870897442906,"sku":"DS200LDCCH1AGA","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/79.1_dcfb351b-43c2-486a-bb17-f5a792eee656.jpg?v=1770948392","url":"https:\/\/www.spareoil.com\/products\/ds200ldcch1aga-ge-drive-control-board-new-original-stock","provider":"SpareOil Automation","version":"1.0","type":"link"}