{"product_id":"ds200tccbg1b-general-electric-mark-v-i-o-board-card","title":"DS200TCCBG1B General Electric Mark V I\/O Board Card","description":"\u003cp\u003eThe \u003cstrong\u003eGeneral Electric DS200TCCBG1B\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDS200TCCB\u003c\/strong\u003e Analog I\/O Board, operates as a dedicated hardware component for analog input and output signal processing within Mark V Speedtronic Turbine Control System platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eModel\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDS200TCCBG1B\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eBrand\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGeneral Electric\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOrigin\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eStandard PCB weight (~0.50 kg \/ 1.1 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOperating Temp\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePower Consumption\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eStandard backplane power rail draw\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eSeries\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eMark V\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Acronym\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eTCCB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Revision\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eRevision B\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePCB Coating\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eNormal Coating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eSignal Processing\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eMulti-channel analog-to-digital (A\/D) and digital-to-analog (D\/A) signal conversion\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOnboard Memory\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eSocketed EPROM \/ PROM IC arrays for firmware execution\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eInterconnects\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eHigh-density multi-pin ribbon connectors and backplane edge connectors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eHardware Configuration\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eHardware jumper arrays for channel scaling and ground selection\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Network \u0026amp; Backplane Integration\u003c\/h3\u003e\n\u003cp\u003eDesigned for seamless integration into the Speedtronic Mark V Triple Modular Redundant (TMR) architecture, the board conditions analog sensor feedback and converts field values into digital signals across the system backplane. Channel-to-channel signal paths maintain strict electrical isolation to eliminate cross-talk and prevent noise propagation into deterministic control loops. Onboard firmware flash compatibility ensures synchronized processing cycles across redundant core processors ($\\text{R}$, $\\text{S}$, and $\\text{T}$).\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Can the DS200TCCBG1B board be hot-swapped while the Mark V rack is fully powered?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: No, power to the local rack and associated I\/O bus section must be isolated before removing or inserting the module to prevent electrical arcs and processor bus faults.\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: What step must be taken regarding jumpers when replacing a DS200TCCBG1B in the field?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: All hardware jumper positions on the replacement board must be manually audited and configured to match the exact physical positions of the original board being replaced.\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: What onboard memory components are present on the DS200TCCBG1B?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: The module contains socketed EPROM\/PROM integrated circuits that store board-level execution firmware and signal scaling routines.\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003e\n\u003cstrong\u003eESD Safety Precautions:\u003c\/strong\u003e Ensure all technicians wear a grounded ESD wrist strap before removing the board from its anti-static protective enclosure.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSystem De-energization:\u003c\/strong\u003e Confirm that power supplies to the specific Mark V card cage section are completely disconnected prior to card insertion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCard Alignment:\u003c\/strong\u003e Align the PCB edges with the card guide rails inside the rack chassis and push firmly until the backplane connectors fully seat.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCable Termination:\u003c\/strong\u003e Attach all ribbon cable headers securely, ensuring lock latches engage cleanly to maintain low-resistance contact.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eGrounding \u0026amp; Shielding:\u003c\/strong\u003e Verify that field cable shields are grounded at the designated ground bar to minimize electromagnetic interference on sensitive analog channels.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":43904470777946,"sku":"DS200TCCBG1B","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/DS200TCCBG1BED.jpg?v=1787649781","url":"https:\/\/www.spareoil.com\/products\/ds200tccbg1b-general-electric-mark-v-i-o-board-card","provider":"SpareOil Automation","version":"1.0","type":"link"}