{"product_id":"f3sp71-4s-fa-m3v-yokogawa-sequence-cpu-module","title":"F3SP71-4S FA-M3V Yokogawa Sequence CPU Module","description":"\u003ch2\u003eYokogawa F3SP71-4S FA-M3V Sequence CPU Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eYokogawa F3SP71-4S\u003c\/strong\u003e serves as the primary \u003cstrong\u003eF3SP71\u003c\/strong\u003e Sequence CPU Module utilized to execute high-speed control logic and advanced application instructions across FA-M3V Programmable Controller platforms. The hardware drives direct physical\/electrical execution utilizing a stored program, repetitive operation cycle via an object ladder language engine. By implementing a high-velocity processing architecture, the card executes localized basic instructions at a speed of 0.00375 us while actively managing synchronous refreshing I\/O paths over the host backplane.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eF3SP71-4S\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eYokogawa\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eJapan\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.12 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e28.9 mm x 100 mm x 83.2 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e460 mA @ 5 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Type\u003c\/td\u003e\n\u003ctd\u003eSequence CPU Modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Compatibility\u003c\/td\u003e\n\u003ctd\u003eFA-M3V Controller Family\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProgram Capacity\u003c\/td\u003e\n\u003ctd\u003e60K ladder steps (120K project steps)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMax I\/O Points\u003c\/td\u003e\n\u003ctd\u003e4096 points local, 8192 points remote\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDevice Capacity\u003c\/td\u003e\n\u003ctd\u003e16K Internal relays, 16K Data registers, 32K File registers\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInstruction Speed\u003c\/td\u003e\n\u003ctd\u003eBasic: 0.00375 us; Application: 0.0075 us\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCommunication Links\u003c\/td\u003e\n\u003ctd\u003eUSB 2.0 (12 Mbps), Ethernet (10\/100BASE-TX)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePeripheral Storage\u003c\/td\u003e\n\u003ctd\u003eSD\/SDHC Memory Card Slot\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eIndustrial Control \u0026amp; Drives Architecture Attributes\u003c\/h3\u003e\n\u003cp\u003eThe processing core features high-performance backplane bus communication velocity licenses that maintain a stable 200 us sensor control I\/O response interval across local modules. The integrated 10\/100BASE-TX network controller executes deterministic protocols including TCP\/IP, UDP\/IP, FTP client\/server, and Modbus\/TCP slave Topologies, allowing concurrent high-density scaling of remote I\/O distributed blocks. Firmware flash compatibility protocols govern operational memory storage, enabling real-time online program edits, constant scan intervals bounded between 0.1 ms and 190 ms, and internal operations log tracking for comprehensive system state diagnostics.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the internal 460 mA current draw at 5 VDC impact power budgeting during system sub-rack assembly?\u003c\/p\u003e\n\u003cp\u003eA: The 460 mA allocation represents the direct structural draw pulled from the base unit backplane power line. Engineers must calculate the total cumulative amperage requirement of all adjacent I\/O and communication cards to verify that the primary system power supply module does not enter an overcurrent trip condition.\u003c\/p\u003e\n\u003cp\u003eQ: What operational response occurs if the internal runtime diagnostic matrix registers a syntax or CPU memory error?\u003c\/p\u003e\n\u003cp\u003eA: The onboard monitoring hardware triggers an immediate system diagnostic alert, halts logic execution depending on severity configurations, and writes the specific error signature to the volatile operation log while activating the front-facing fault LED indicators to isolate the failed hardware layer.\u003c\/p\u003e\n\u003cp\u003eQ: In what manner does the unit maintain program retention if the primary rack power is disconnected without an attached battery?\u003c\/p\u003e\n\u003cp\u003eA: The module relies on non-volatile storage sectors to secure the 60K ladder steps of program capacity. Additionally, technicians can load complete project configurations onto a validated SD\/SDHC memory card via the integrated slot to facilitate instant hardware replication without requiring terminal PC programming links.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSub-Rack Mechanical Alignment:\u003c\/strong\u003e Insert the CPU module vertically into slot 1 of the FA-M3V base unit, pushing until the lower and upper lock tabs click firmly to guarantee precise pin alignment with the backplane data bus.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eNetwork Cable Shield Layout:\u003c\/strong\u003e Connect all industrial Ethernet communication cables using fully shielded RJ45 plugs, routing the outer metallic braid to the cabinet earth ground bus bar to eliminate high-frequency electromagnetic noise entry.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSeparation of Signal Conductors:\u003c\/strong\u003e Maintain a physical path spacing of at least 200 mm between the internal low-voltage USB\/Ethernet links and neighboring high-voltage AC power lines or variable frequency drive cables.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSD Card Removal Procedure:\u003c\/strong\u003e Do not eject the SD\/SDHC memory card while the active read\/write LED indicator is illuminated, as unexpected media removal during file operations will corrupt the historical logging partition.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Yokogawa","offers":[{"title":"Default Title","offer_id":43660903448666,"sku":"F3SP71-4S","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/509._299507f3-d213-4158-8fac-0b60cae80175.jpg?v=1784085456","url":"https:\/\/www.spareoil.com\/products\/f3sp71-4s-fa-m3v-yokogawa-sequence-cpu-module","provider":"SpareOil Automation","version":"1.0","type":"link"}