{"product_id":"ge-ds200ldccg1aaa-drive-control-lan-communications-board","title":"GE DS200LDCCG1AAA Drive Control\/LAN Communications Board","description":"\u003cp\u003eThe \u003cstrong\u003eGE DS200LDCCG1AAA\u003c\/strong\u003e serves as the primary \u003cstrong\u003eLDCC\u003c\/strong\u003e Drive Control\/LAN Communications Board utilized to execute multi-bus signal translation and real-time motor algorithm processing across GE DIRECTO-MATIC 2000 platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eModel\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDS200LDCCG1AAA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eBrand\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGE (General Electric)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOrigin\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eOperating Temp\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePower Consumption\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eBus-powered via rack backplane\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eProduct Series\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDIRECTO-MATIC 2000\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eProcessor Locations\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eU1 (DCP), U21 (MCP), U35 (CMP), U18 (LCP)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePCB Coating\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eNormal Coating (G1 group variant)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eInstruction Manual\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGEI-100216\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDrive Control Architecture \u0026amp; Deterministic Processing\u003c\/h3\u003e\n\u003cp\u003eThe DS200LDCCG1AAA integrates a quad-processor architecture to maintain backplane bus communication velocity and deterministic control loop execution. Peripheral I\/O routines, timer operations, and A\/D or D\/A conversions are executed locally by the Drive Control Processor (DCP at location U1). Motor control routines and digital I\/O handling are governed by the Motor Control Processor (MCP at location U21), with complex, math-intensive field-oriented vector calculations offloaded to the Co-Motor Processor (CMP at location U35). Dedicated local network interfacing is executed by the LAN Control Processor (LCP at location U18), preserving execution throughput and firmware flash compatibility across connected DIRECTO-MATIC drives.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What physical locations do the four onboard microprocessors occupy on the circuit board?\u003c\/p\u003e\n\u003cp\u003eA: The microprocessors are arranged as follows: Drive Control Processor (DCP) at location U1, Motor Control Processor (MCP) at U21, Co-Motor Processor (CMP) at U35, and LAN Control Processor (LCP) at U18.\u003c\/p\u003e\n\u003cp\u003eQ: How does the normal coating variant (G1) impact physical installation and environment compatibility?\u003c\/p\u003e\n\u003cp\u003eA: The normal coating (G1) provides localized standard insulation layer thickness across the PCB trace layout; however, it lacks the full surface immersion coverage provided by fully conformally coated cards (H variants) in extreme environments.\u003c\/p\u003e\n\u003cp\u003eQ: Does the board require external power supplies for processor logic execution?\u003c\/p\u003e\n\u003cp\u003eA: No, operational power for the microprocessor logic array, memory PROMs, and communication interface circuits is derived directly from the rack backplane power bus.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eDisconnect main line power to the DIRECTO-MATIC drive system and confirm zero-voltage state before opening the module rack enclosure.\u003c\/li\u003e\n\u003cli\u003eWear an approved ESD grounding strap connected to the metal frame of the system enclosure prior to removing the card from its static-shielding envelope.\u003c\/li\u003e\n\u003cli\u003eCheck hardware jumpers against project schematic drawings to match backplane address settings before rack insertion.\u003c\/li\u003e\n\u003cli\u003eAlign the board edges with the panel guide rails and firmly press the assembly into the card cage to ensure total engagement of the backplane connectors.\u003c\/li\u003e\n\u003cli\u003eTerminate all incoming LAN cable shielding to the local earth ground bus using low-impedance pigtails to suppress high-frequency noise interference.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43874336505946,"sku":"DS200LDCCG1AAA","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/DS200LDCCH1ALA_c1c48e05-e154-471e-a718-5966a6d57985.png?v=1787212816","url":"https:\/\/www.spareoil.com\/products\/ge-ds200ldccg1aaa-drive-control-lan-communications-board","provider":"SpareOil Automation","version":"1.0","type":"link"}