{"product_id":"ge-ic693acc310-series-90-30-filler-module","title":"GE IC693ACC310 Series 90-30 Filler Module","description":"\u003cp\u003eConfigured for physical protection of unpopulated baseplate slots in Series 90-30 chassis, the \u003cstrong\u003eGE IC693ACC310\u003c\/strong\u003e (\u003cstrong\u003eIC693ACC310\u003c\/strong\u003e Filler Module) provides direct physical enclosure containment.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC693ACC310 (also references IC694ACC310 cross-compatibility)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc \/ Emerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eFactory standard\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.11 kg (0.25 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eSingle-slot mechanical footprint\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003eStandard industrial limits (0 to 60 deg C equivalent)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e0 mA (No backplane current draw)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Width\u003c\/td\u003e\n\u003ctd\u003eSingle slot\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupply Voltage\u003c\/td\u003e\n\u003ctd\u003eNone\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackplane Connection\u003c\/td\u003e\n\u003ctd\u003eNon-electrical physical fitment only\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLED Indicators\u003c\/td\u003e\n\u003ctd\u003eNone\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBaseplate Compatibility\u003c\/td\u003e\n\u003ctd\u003eIC693CPU311, IC693CPU313, IC693CPU323, IC693CHS397, IC693CHS391, IC693CHS398, IC693CHS392, IC693CHS399, IC693CHS393\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHot-Swap Execution\u003c\/td\u003e\n\u003ctd\u003eSupported (No backplane current interruption)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Isolation and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe module functions strictly as a non-electrical mechanical barrier to maintain chassis structural integrity and fulfill environmental isolation mandates. By populating unassigned chassis slots, it prevents the entry of conductive dust, moisture, and chemical particulates into adjacent exposed backplane connectors. Because the hardware contains no active logic gates or semiconductor components, it exhibits zero impact on the host backplane bus communication velocity and does not modify the master I\/O density scaling maps. The absence of electrical traces ensures that insertion or removal has no loading effect on the deterministic networks of the active baseplate.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Can this module be inserted or removed while the host PLC rack is energized?\u003c\/p\u003e\n\u003cp\u003eA: Yes. Because the module does not establish electrical contact with the backplane bus pins and draws 0 mA of current, insertion and removal under power are supported without risk of bus voltage dips or communication faults.\u003c\/p\u003e\n\u003cp\u003eQ: Is configuration or software I\/O tagging required within the programming environment?\u003c\/p\u003e\n\u003cp\u003eA: No. The unit contains no active electronic circuitry or internal registers. It is transparent to the CPU and requires no allocation in the hardware configuration matrix or programming software.\u003c\/p\u003e\n\u003cp\u003eQ: Does the module contain status LEDs or terminal block assignments?\u003c\/p\u003e\n\u003cp\u003eA: No. The front faceplate is entirely blank, featuring no LED status indicators, module labels, or provisions for terminal block engagement.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eInspect the vacant baseplate slot to ensure the physical guide tracks and the rear connector recess are clear of debris.\u003c\/li\u003e\n\u003cli\u003eAlign the mechanical plastic guides of the module with the top and bottom channels of the target empty chassis slot.\u003c\/li\u003e\n\u003cli\u003eSlide the unit into the slot horizontally, maintaining parallel alignment with adjacent active I\/O modules.\u003c\/li\u003e\n\u003cli\u003ePress the module firmly into the chassis until the top and bottom structural retention latches snap and lock onto the baseplate frame.\u003c\/li\u003e\n\u003cli\u003eWhen executing insertion or removal in operating environments prone to sustained mechanical vibration or shock, support adjacent wiring harnesses to prevent unintended displacement.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43616376782938,"sku":"IC693ACC310","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/IC693ACC310.png?v=1783477940","url":"https:\/\/www.spareoil.com\/products\/ge-ic693acc310-series-90-30-filler-module","provider":"SpareOil Automation","version":"1.0","type":"link"}