{"product_id":"ge-ic695chs016-pacsystem-rx3i-universal-backplane","title":"GE IC695CHS016 PACSystem RX3i Universal Backplane","description":"\u003cp\u003eThe \u003cstrong\u003eGE IC695CHS016\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC695CHS016\u003c\/strong\u003e Universal Backplane, operates as a dedicated hardware component for module connectivity and internal communication execution within PACSystem RX3i networks.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC695CHS016\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc Emerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e4.56 lbs (2.07 kg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e601.98 mm (w) x 141.5 mm (h) x 147.32 mm (d)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C (Standard industrial range)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e600 mA at 3.3 VDC and 240 mA at 5 VDC internal load\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Slots\u003c\/td\u003e\n\u003ctd\u003e16 slots\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBus Interface\u003c\/td\u003e\n\u003ctd\u003eIntegrated PCI bus and High-speed serial bus\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInput Voltage\u003c\/td\u003e\n\u003ctd\u003e+24 VDC (Isolated input connection via TB1)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInput Terminals\u003c\/td\u003e\n\u003ctd\u003eTerminal 7: Isolated 24 VDC, Terminal 8: Isolated ground\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRecommended Wire Size\u003c\/td\u003e\n\u003ctd\u003e14 to 22 AWG\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Orientation\u003c\/td\u003e\n\u003ctd\u003eHorizontal only\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRequired Clearance\u003c\/td\u003e\n\u003ctd\u003e102 mm (4 inches) on all sides\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEnclosure Protection\u003c\/td\u003e\n\u003ctd\u003eNEMA\/UL Type 1 (IP20 minimum rated subpanel enclosure)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe chassis incorporates a dual-bus subsystem backplane structure that establishes simultaneous routing for PCI signaling and legacy serial communications. This arrangement facilitates multi-generation I\/O density scaling, allowing the 16-slot frame to host both PACSystem RX3i architectures and Series 90-30 discrete or analog components. Backplane bus communication velocity is optimized through direct data plane traces, preventing performance degradation when multiple high-density communication modules execute parallel processing routines across the system rack.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the IC695CHS016 backplane support active hot-swapping of modules during system operation?\u003c\/p\u003e\n\u003cp\u003eA: Yes. The mechanical bus connectors support hot-swapping functionality for compatible hardware modules. This allows maintenance personnel to remove or insert I\/O components without disrupting the internal communications or shutting down power to adjacent active slots.\u003c\/p\u003e\n\u003cp\u003eQ: How is the physical space allocated for modules requiring wider footprints, such as AC power supplies?\u003c\/p\u003e\n\u003cp\u003eA: The 16 slots are uniform in geometry, but specialized modules (e.g., high-capacity AC power supply modules) will physically occupy two adjacent slots. The physical backplane configuration must be configured in the software logic to reflect the correct slot utilization matrix.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanical Placement\u003c\/strong\u003e: Install the backplane strictly in a horizontal orientation inside the enclosure panel. Fasten the chassis securely to the metal subpanel using standard mounting hardware through the integrated mounting holes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnvironmental Clearances\u003c\/strong\u003e: Maintain a rigid minimum clearance boundary of 102 mm (4 inches) on all top, bottom, and side panels of the rack to allow natural convection air currents to cool the mounted modules.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eGrounding and Power Input\u003c\/strong\u003e: Connect the incoming isolated +24 VDC power supply to Terminal 7 of the TB1 strip, and terminate the isolated ground to Terminal 8. Utilize the integrated grounding bar and a low-impedance ground strap bonded directly to the enclosure earth system to suppress electrical transients.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43616524304474,"sku":"IC695CHS016","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/IC695CHS016.png?v=1783481894","url":"https:\/\/www.spareoil.com\/products\/ge-ic695chs016-pacsystem-rx3i-universal-backplane","provider":"SpareOil Automation","version":"1.0","type":"link"}