{"product_id":"ic694mdl754-ge-fanuc-pacsystems-rx3i-datasheet-technical-manual","title":"IC694MDL754 GE Fanuc PACSystems RX3i Datasheet \u0026 Technical Manual","description":"\u003ch2\u003eGE Fanuc IC694MDL754 PACSystems RX3i Discrete Output Module\u003c\/h2\u003e\n\u003cp\u003eConfigured for high-density discrete switching tasks in PACSystems RX3i networks, the \u003cstrong\u003eGE Fanuc IC694MDL754\u003c\/strong\u003e (\u003cstrong\u003eIC694MDL754\u003c\/strong\u003e Discrete Output Module) provides direct physical\/electrical execution. This hardware component routes 12\/24 VDC positive logic sourcing power straight to industrial field loads through two galvanically isolated point groups.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC694MDL754\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc (Emerson Automation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.38 kg (0.84 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard RX3i single-slot module dimensions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e300 mA @ 5 VDC (Backplane current consumption)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Points\u003c\/td\u003e\n\u003ctd\u003e32 points divided into 2 groups of 16\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLogic Type\u003c\/td\u003e\n\u003ctd\u003ePositive Logic (Sourcing)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Voltage Range\u003c\/td\u003e\n\u003ctd\u003e+10.2 to +30 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaximum Output Current\u003c\/td\u003e\n\u003ctd\u003e0.75 A per point (Maximum 12 A per module, temperature dependent)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSwitching Response Time\u003c\/td\u003e\n\u003ctd\u003eLess than or equal to 0.5 ms (Off-to-On and On-to-Off)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation\u003c\/td\u003e\n\u003ctd\u003e250 VAC continuous (Field-to-Backplane and Group-to-Group)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShort Circuit Protection\u003c\/td\u003e\n\u003ctd\u003eElectronic Short Circuit Protection (ESCP) per individual point\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLED Status Indicators\u003c\/td\u003e\n\u003ctd\u003e32 green point status LEDs, 1 red module fault LED\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTerminal Block Compatibility\u003c\/td\u003e\n\u003ctd\u003eIC694TBB032 or IC694TBS032\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCertifications\u003c\/td\u003e\n\u003ctd\u003eUL, CSA, CE, Class I Division 2 Hazardous Locations\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication and Network Execution\u003c\/h3\u003e\n\u003cp\u003eThe IC694MDL754 interfaces directly with the PACSystems RX3i backplane bus, utilizing a high-velocity parallel bus structure to exchange standard discrete output data tables with the central processing unit. The logic processing mechanism relies on firmware flash compatibility metrics that align directly with the primary CPU operating system revision. Upon receiving command words over the backplane bus, the module executes point-state updates in less than 0.5 ms. When short-circuit or overcurrent events trigger the Electronic Short Circuit Protection (ESCP) circuitry on any individual channel, the onboard logic isolates the faulted point and transmits an immediate diagnostic fault interrupt packet across the backplane bus to the RX3i CPU, stopping localized damage without dropping overall network synchronization.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eQ: Does the IC694MDL754 support hot-swap insertion and removal within the RX3i backplane?\u003c\/strong\u003e A: No. Standard RX3i single-slot backplanes do not permit hot-swapping of discrete I\/O modules. System power to the local backplane rack must be completely isolated before inserting or removing the module to prevent electrical damage to the backplane communication pins.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQ: What happens to the output states if the module loses backplane communication with the CPU?\u003c\/strong\u003e A: Upon detection of a backplane communication loss, the module executes a predefined fail-safe command sequence. All 32 discrete output channels automatically transition to a de-energized (Off) state to secure the connected field elements.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQ: How does the maximum module current scale with ambient temperature?\u003c\/strong\u003e A: While each point can handle up to 0.75 A individually, the aggregate module limit is restricted to 12 A under baseline conditions. At higher ambient temperatures up to the 60 deg C limit, standard thermal dissipation profiles dictate derating schedules that reduce the total simultaneous current capacity across both 16-point groups.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMounting and Orientation:\u003c\/strong\u003e Slide the module firmly into a single slot of an RX3i universal backplane until the top and bottom connectors seat completely. Tighten any integrated retention screws to secure the chassis connection.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTerminal Wiring Architecture:\u003c\/strong\u003e Utilize either the IC694TBB032 (Box style) or IC694TBS032 (Spring style) 36-terminal block. Route field wiring using copper conductors rated for the specific current load and an operating temperature range suitable for the environment. Ensure appropriate separation between the DC output wiring and any high-voltage AC cables within the wire duct.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower Source Separation:\u003c\/strong\u003e Wire each of the two 16-point groups (Points 1-16 and Points 17-32) to independent 12\/24 VDC external power supplies if distinct electrical isolation between banks is required. Each group possesses its own isolated common return pin.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eShielding and Grounding:\u003c\/strong\u003e Standard industrial practice requires all external field power supply commons to be securely tied to the primary system functional earth ground at a single point. Ensure the backplane rack is mounted to a grounded metal subpanel to enable low-impedance paths for transient noise suppression.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":42870902161498,"sku":"IC694MDL754","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/178_22518795-9118-41f3-ad3f-fb07ad6d1676.jpg?v=1771055349","url":"https:\/\/www.spareoil.com\/products\/ic694mdl754-ge-fanuc-pacsystems-rx3i-datasheet-technical-manual","provider":"SpareOil Automation","version":"1.0","type":"link"}