{"product_id":"ic694mdl758-ge-fanuc-pacsystems-rx3i-discrete-output-module","title":"IC694MDL758 GE Fanuc PACSystems RX3i Discrete Output Module","description":"\u003cp\u003eThe \u003cstrong\u003eGE IC694MDL758\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC694MDL758\u003c\/strong\u003e Discrete Output Module, operates as a dedicated hardware component for solid-state switching of low-voltage direct current loads within PACSystems RX3i networks.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC694MDL758\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc \/ Emerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eFactory standard\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.36 kg (3.00 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eSingle-slot chassis occupancy\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e250 mA maximum at 5.0 VDC (from backplane bus)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChannel Density\u003c\/td\u003e\n\u003ctd\u003e32 discrete outputs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Grouping\u003c\/td\u003e\n\u003ctd\u003e2 isolated groups (16 channels per group)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Logic Type\u003c\/td\u003e\n\u003ctd\u003ePositive logic (Sourcing)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRated Operating Voltage\u003c\/td\u003e\n\u003ctd\u003e12 \/ 24 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Voltage Range\u003c\/td\u003e\n\u003ctd\u003e10.2 to 28.8 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Current per Point\u003c\/td\u003e\n\u003ctd\u003e0.5 A maximum\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Current per Group\u003c\/td\u003e\n\u003ctd\u003e8.0 A maximum\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInrush Current Rating\u003c\/td\u003e\n\u003ctd\u003e5.4 A for 10 ms (without an ESCP trip)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaximum Response Time\u003c\/td\u003e\n\u003ctd\u003e0.5 ms\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation\u003c\/td\u003e\n\u003ctd\u003eGalvanic group-to-group isolation\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStatus Indicators\u003c\/td\u003e\n\u003ctd\u003e32 green channel LEDs, 2 fault LEDs, 1 module status LED\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompatible Terminal Blocks\u003c\/td\u003e\n\u003ctd\u003eIC694TBB032 (box-style) or IC694TBS032 (spring-style)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Compatibility\u003c\/td\u003e\n\u003ctd\u003ePACSystems RX3i CPU slots only (Incompatible with Series 90-30)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Networks and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe module executes discrete automation routines by shifting 32 solid-state sourcing outputs across the local PACSystems RX3i parallel backplane. To maintain deterministic networks performance when scaling high-density electronic modules inside the chassis, the device draws a constant 250 mA from the 5.0 VDC backplane bus. Built-in electronic short-circuit protection (ESCP) monitors the physical circuit loops across each group common. If a localized short-circuit occurs, the ESCP infrastructure isolates the fault, bounds the internal thermal heat sink dissipation profile, and routes a digital diagnostic error frame directly to the master CPU without disrupting backplane bus communication velocity.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does this module support live insertion and extraction (hot-swapping) during controller operation?\u003c\/p\u003e\n\u003cp\u003eA: Yes. The PACSystems RX3i system architecture permits hot-swap execution of this module, provided the technician complies with the grounding practices, backplane capacity limits, and mechanical extraction guidelines specified in the RX3i installation manual.\u003c\/p\u003e\n\u003cp\u003eQ: How does the module handle a sudden loss of field-side supply voltage within an output group?\u003c\/p\u003e\n\u003cp\u003eA: The hardware logic incorporates diagnostic sub-circuits that detect the loss of external field power for each of the two isolated groups. Upon detection, it toggles a dedicated fault LED indicator on the front panel and generates a structured fault report for transmission to the RX3i controller.\u003c\/p\u003e\n\u003cp\u003eQ: Is this module backward compatible with older Series 90-30 PLC backplanes?\u003c\/p\u003e\n\u003cp\u003eA: No. The firmware and electrical interface of the module are designed exclusively for the PACSystems RX3i platform. It cannot be mapped or installed within a Series 90-30 chassis.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eIsolate all external direct current field loop power supplies and backplane inputs before initiating terminal connections or module placement.\u003c\/li\u003e\n\u003cli\u003eMatch the structural enclosure of the module with the precise physical slot paths of the target RX3i baseplate.\u003c\/li\u003e\n\u003cli\u003ePush the module firmly into the slot until the upper and lower plastic locking tabs click onto the chassis rail hooks.\u003c\/li\u003e\n\u003cli\u003eSeat either the IC694TBB032 box-style or IC694TBS032 spring-style 32-point terminal block into the front faceplate connection pins.\u003c\/li\u003e\n\u003cli\u003eLay all low-voltage 12\/24 VDC sourcing signal lines in segregated cable trays positioned at a minimum distance of 30 cm from high-power AC lines or motor control conductors to minimize electromagnetic interference.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43616481476698,"sku":"IC694MDL758","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/IC694MDL758.png?v=1783480717","url":"https:\/\/www.spareoil.com\/products\/ic694mdl758-ge-fanuc-pacsystems-rx3i-discrete-output-module","provider":"SpareOil Automation","version":"1.0","type":"link"}