{"product_id":"is200aebmg1afb-ge-mark-vi-advanced-engineering-bridge-module","title":"IS200AEBMG1AFB GE Mark VI Advanced Engineering Bridge Module","description":"\u003cp\u003eThe \u003cstrong\u003eGE IS200AEBMG1AFB\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIS200AEBMG1A\u003c\/strong\u003e Advanced Engineering Bridge Module, operates as a dedicated hardware component for high-speed signal routing and interface bridging within GE Mark VI Speedtronic platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIS200AEBMG1AFB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE (General Electric)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-30 to 65 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eSubrack Backplane Power Draw\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFunctional Acronym\u003c\/td\u003e\n\u003ctd\u003eAEBM\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAssembly Type\u003c\/td\u003e\n\u003ctd\u003eNormal Assembly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePCB Coating\u003c\/td\u003e\n\u003ctd\u003eNormal Coating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFrame Mounting\u003c\/td\u003e\n\u003ctd\u003eCarrier Frame 1151x122OBQ01\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRevision Level\u003c\/td\u003e\n\u003ctd\u003eThree-Fold Revision (AFB) with Backward Compatibility for First Two Revisions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Series\u003c\/td\u003e\n\u003ctd\u003eMark VI Speedtronic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity \u0026amp; Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe IS200AEBMG1AFB interfaces directly with VME rack structures via its carrier frame mounting layout to support localized signals. Optimized for backplane bus communication velocity, the board facilitates real-time data frame transfers between processor nodes and secondary I\/O units across deterministic networks. Firmware flash compatibility guarantees synchronous execution with Mark VI control routines, preventing processing latencies and maintaining signal integrity across the backplane.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How is the IS200AEBMG1AFB board mechanically secured inside a VME rack cabinet?\u003c\/p\u003e\n\u003cp\u003eA: The circuit board is mounted to a carrier frame designated 1151x122OBQ01, featuring extended screw mounts along both long sides for secure installation in VME rack assemblies without a standard faceplate.\u003c\/p\u003e\n\u003cp\u003eQ: What is the backward compatibility scope for the AFB revision level of this module?\u003c\/p\u003e\n\u003cp\u003eA: The three-fold revision version (AFB) maintains functional backward compatibility with the first two revisions of the IS200AEBMG1A group.\u003c\/p\u003e\n\u003cp\u003eQ: Does the IS200AEBMG1AFB PCB feature conformal coating?\u003c\/p\u003e\n\u003cp\u003eA: No, the board is manufactured with a normal PCB coating style and standard assembly configuration.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eIsolate and lock out all main power connections to the target VME subrack enclosure prior to board installation or removal.\u003c\/li\u003e\n\u003cli\u003ePut on an anti-static ESD grounding wrist strap connected to an unpainted chassis ground point.\u003c\/li\u003e\n\u003cli\u003eAlign the side flanges of the 1151x122OBQ01 carrier frame with the designated card slot guide rails.\u003c\/li\u003e\n\u003cli\u003eSlide the module assembly smoothly backward until backplane connectors align fully with the rack receivers.\u003c\/li\u003e\n\u003cli\u003eTighten all side retaining screws on the carrier frame to secure the module against vibration and establish chassis ground continuity.\u003c\/li\u003e\n\u003cli\u003eRe-check all hardware interface fasteners and ground straps before re-energizing the rack power supply.\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003cp\u003e \u003c\/p\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43838358454362,"sku":"IS200AEBMG1AFB","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5957\/0778\/files\/IS200AEBMG1AFB.png?v=1786587718","url":"https:\/\/www.spareoil.com\/products\/is200aebmg1afb-ge-mark-vi-advanced-engineering-bridge-module","provider":"SpareOil Automation","version":"1.0","type":"link"}