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Yokogawa ANB10D-425/CU2T ESB Bus Node Units

Configured for dual-redundant ESB bus communication in CENTUM VP systems, the Yokogawa ANB10D-425/CU2T (ANB10D ESB Bus Node Unit) provides direct physical/electrical execution. It interfaces between peripheral field I/O modules and the Field Control Unit (FCU), ensuring data transmission across 2 Mbps bus channels. This node unit integrates a dedicated physical termination assembly (/CU2T option) to stabilize bus impedances and suppress signal reflections over physical communication lengths up to 2 km.

Suffix Breakdown & Model Matrix

The alphanumeric suffix configurations for the ANB10D series dictate specific factory-built hardware parameters:

  • ANB10D: Node Unit for Dual-Redundant ESB Bus
  • -4: Dual-redundant power supply
  • 2: 220 - 240 V AC power supply
  • 5: Basic type with no explosion protection
  • /CU2T: Connector Unit with Terminator for ESB Bus

Hardware Specifications

Parameter Specification
Model ANB10D-425/CU2T
Brand Yokogawa
Origin Japan
Weight 10 kg (Shipping Weight: 12 kg)
Dimensions Standard 19-inch rack mountable
Operating Temp -20 to +60 deg C
Power Consumption 200 VA (100-120 V AC), 230 VA (220-240 V AC), 5.5 A (24 V DC)
Input Channels 10 channels (digital input)
Input Signal Type Dry contact, NPN/PNP transistor input
Input Voltage Range 12-24 V DC
Input Current Less than or equal to 8 mA per channel
Response Time Less than or equal to 5 ms (on/off)
Isolation 1000 V AC (channel-to-system, channel-to-channel)
Bus Architecture Dual-redundant ESB bus, less than or equal to 10 ms failover
Communication Protocols V-net, TCP/IP, OPC UA
I/O Expansion Capacity Up to 128 modules
Vibration Resistance Up to 15 g

DCS Interface & Channel Isolation

Operating within a Yokogawa DCS framework, this unit regulates multi-channel data flow through 1000 V AC galvanic isolation boundaries that isolate the field-side loops from the internal processing backplane. The field communication ports handle direct transmitter interfaces, using 4-20 mA HART loop protocol parameters to extract primary process variables. The physical design integrates channel-to-channel isolation to prevent electrical interference from disrupting analog input loops. Where thermal instrumentation is connected, standard cold junction compensation (CJC) takes place at the terminal block, maintaining system loop integrity.

Frequently Asked Questions

Q: What is the mechanical function of the /CU2T option on this node unit?

A: The /CU2T option installs a hardware connector unit equipped with a built-in electrical terminator. This terminator matches the characteristic impedance of the ESB bus, preventing wave reflections along long-distance cable runs.

Q: How does the dual-redundant power supply handle input voltage fluctuations?

A: The dual-redundant power supply modules accept a wide voltage tolerance. If one supply drops below the threshold, the secondary power supply assumes the full electrical load within a bumpless window, sustaining normal operations without module downtime.

Q: Does this model support hot-swapping of standard I/O cards?

A: Yes, standard I/O cards mounted within the 8-slot chassis can be hot-swapped while the node remains energized, provided the backplane communications remain active and standard ESD safety precautions are implemented.

Field Installation Guidelines

  • Terminator Verification: Verify that the /CU2T terminator module is securely seated at the physical end of the ESB bus segment to prevent communication faults caused by mismatched line impedances.
  • Grounding Requirements: Connect the unit chassis to a dedicated, low-impedance instrument ground. Ground resistance must be kept below 100 ohms, and this ground path must not be shared with noisy electrical or motor frames.
  • Cable Separation: Route all ESB bus communication cables through dedicated conduits. Do not run communication cables parallel to heavy AC power cabling or variable frequency drive (VFD) output cables to avoid noise coupling.
  • Cooling Clearances: Ensure that standard 19-inch rack installations allow at least 100 mm of clear space above and below the chassis. This maintains proper vertical airflow for the fanless cooling design.

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