ADV157-S00 YOKOGAWA FIO Series Datasheet & Technical Manual

Yokogawa ADV157-S00 FIO Digital Input Module

Yokogawa ADV157-S00 FIO Digital Input Module

Disponibilidad: 99 Quedan en stock

YOKOGAWA ADV157-S00 FIO Digital Input Module Configured for high-speed discrete signal acquisition in distributed control networks, the YOKOGAWA ADV157-S00, also...

Código: ADV157-S00

Manufacturer: Yokogawa
Product No.: ADV157-S00
Product Type: Digital Input Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 400g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

YOKOGAWA ADV157-S00 FIO Digital Input Module

Configured for high-speed discrete signal acquisition in distributed control networks, the YOKOGAWA ADV157-S00, also cataloged as the ADV157 Digital Input Module, operates as a dedicated hardware component for binary ON/OFF status processing within CENTUM VP, CENTUM CS, and ProSafe-RS systems. The module interfaces with field switches, interlocks, and sensor contacts, executing direct physical voltage translation into system logic states across a 32-channel medium-density architecture.

Hardware Specifications

Parameter	Specification
Model	ADV157-S00
Brand	YOKOGAWA
Origin	Japan
Weight	0.4 kg net (1.5 kg shipping weight)
Dimensions	130 x 119.9 x 32.8 mm
Operating Temp	0 to 55 deg C
Power Consumption	Max. 350 mA at 5 VDC
Module Type	Digital Input Module
Number of Input Channels	32 (isolated in 2 blocks of 16 channels)
Rated Input Voltage	24 VDC (sink/source type)
Input ON Voltage	18 to 26.4 VDC
Input OFF Voltage	5.0 VDC or less
Input Current	4.1 mA plus/minus 20% per channel
Maximum Allowable Voltage	30 VDC
Withstanding Voltage	2 kV AC between input and system; 500 V AC between commons per 16 channels
Input Response Time	Less than or equal to 8 ms (status input); 1 ms typical high-speed acquisition
Minimum ON Detection Time	20 ms (for pushbutton input tracking)
Max ON/OFF Cycle Frequency	25 Hz (for pushbutton input tracking)
External Connection	Pressure clamp terminal / MIL connector cable interface options

Process Control and DCS Instrumentation Features

The hardware incorporates a dedicated 4-20 mA HART loop protocol layer compatibility framework alongside foundational system bus isolation barriers. Channel-to-channel block isolation prevents localized ground loops from propagating across the internal backplane architecture. The input circuitry utilizes explicit galvanic isolation rated at 2 kV AC between the field wiring and the system internal logic, establishing stable common-mode rejection performance. Internal logic circuits continuously scan the 32 discrete channels, utilizing software-configurable input filter coefficients to reject high-frequency contact bounce while maintaining deterministic edge counting and status tracking capabilities.

Frequently Asked Questions

Q: Does the ADV157-S00 module support live insertion or hot-swapping during active system operation?

A: Insertion and removal must follow the specific system chassis guidelines. While the FIO backplane physically supports hot-swap operations, removal of an active module interrupts the 32 discrete signal channels immediately, which causes field data loss and potential system trip execution if connected to interlock loops.

Q: What is the specific functional configuration of the internal common lines for the 32 channels?

A: The 32 input channels are split into two independent isolated blocks of 16 channels each. Each block shares a dedicated common terminal, allowing distinct external 24 VDC power supplies to feed separate field wiring segments without electrical cross-talk.

Q: How does the module handle voltage spikes or sustained overvoltage conditions on the field inputs?

A: The module tolerates a maximum continuous overvoltage of 30 VDC. Any voltage transients exceeding the integrated protection limits risk degrading the input optocouplers, requiring external surge suppression devices if lines run through outdoor areas.

Field Installation Guidelines

Chassis Mounting: Secure the module firmly into the designated FIO node slot until the locking mechanism engages completely. Avoid applying uneven mechanical force during insertion to prevent pin deformation on the backplane connector.
Shielding and Grounding: Terminate all external instrument cable shields at the dedicated functional ground bar within the enclosure. Maintain separate routing channels for high-voltage power cables and low-voltage 24 VDC signal lines to eliminate electromagnetic noise coupling.
Wiring Termination: When utilizing the pressure clamp terminals, strip insulation strictly according to the terminal block specification (typically 7 mm). Ensure all conductor strands are fully inserted before tightening to maintain low contact resistance.
Terminal Block Engagement: Verify that the front connector block screws are torqued down correctly before powering the loop. Loose terminations cause intermittent contact bounce, triggering false input state transitions.

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