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Product Description

Overview

The GE Fanuc IC694ACC310 is a PACSystems RX3i blank slot filler module designed to occupy unused slots in RX3i backplanes. While it performs no electrical or control function, it plays an important role in maintaining system integrity by supporting proper airflow, preventing dust ingress, and protecting internal circuitry from accidental contact.

The IC694ACC310 is compatible with all RX3i CPU systems and baseplates, including main, expansion, and remote racks. It supports insertion and removal under power, allowing system configuration changes without shutdown.

Technical Specifications

Parameter Specification
Model IC694ACC310
Manufacturer GE Fanuc Emerson
Product Line PACSystems RX3i
Module Type Blank Slot Filler / Slot Cover
Function Covers unused backplane slots
Slots Covered 1 slot
Compatible CPUs All RX3i CPUs
Compatible Racks Main, Expansion, Remote
Compatible Baseplates 7, 12, 16-slot standard baseplates

5, 10-slot expansion baseplates
Removal/Insertion Under Power Supported
Vibration Prevention Supported
Water Exposure Mitigation Passive protection
Installation Limit Unlimited per system
Operating Environment Same as RX3i system
Operating Temperature 0°C to +60°C
Weight 0.20–0.25 lbs (0.09–0.11 kg)
Material Industrial-grade molded composite
Indicators None

 

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