The GE Fanuc IC694ACC310 is a PACSystems RX3i blank slot filler module designed to occupy unused slots in RX3i backplanes. While it performs no electrical or control function, it plays an important role in maintaining system integrity by supporting proper airflow, preventing dust ingress, and protecting internal circuitry from accidental contact.
The IC694ACC310 is compatible with all RX3i CPU systems and baseplates, including main, expansion, and remote racks. It supports insertion and removal under power, allowing system configuration changes without shutdown.
| Parameter | Specification |
|---|---|
| Model | IC694ACC310 |
| Manufacturer | GE Fanuc Emerson |
| Product Line | PACSystems RX3i |
| Module Type | Blank Slot Filler / Slot Cover |
| Function | Covers unused backplane slots |
| Slots Covered | 1 slot |
| Compatible CPUs | All RX3i CPUs |
| Compatible Racks | Main, Expansion, Remote |
| Compatible Baseplates | 7, 12, 16-slot standard baseplates |
| 5, 10-slot expansion baseplates | |
| Removal/Insertion Under Power | Supported |
| Vibration Prevention | Supported |
| Water Exposure Mitigation | Passive protection |
| Installation Limit | Unlimited per system |
| Operating Environment | Same as RX3i system |
| Operating Temperature | 0°C to +60°C |
| Weight | 0.20–0.25 lbs (0.09–0.11 kg) |
| Material | Industrial-grade molded composite |
| Indicators | None |
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