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ICS Triplex T9310-02 Trusted Processor Module

The ICS Triplex T9310-02, also cataloged as the T9310-02 Processor Module, operates as a dedicated hardware component for main CPU logic execution within Trusted triple modular redundant (TMR) safety systems.

Hardware Specifications

Parameter Specification
Model T9310-02
Brand ICS Triplex (Rockwell Automation)
Origin USA
Weight 0.5 kg
Dimensions 10.5 cm x 15.4 cm x 12.6 cm
Operating Temp -20 deg C to +60 deg C
Power Consumption 24 VDC bus powered
Processor Architecture Triple Modular Redundant (three PowerPC CPUs in lockstep)
Clock Speed ~200 MHz
Isolation 1500 to 2500 V between logic and field wiring
System Compatibility Trusted TMR backplane platforms

Triple Modular Redundancy & SIS Execution

The controller subsystem coordinates data synchronization and voting routines across three distinct execution branches to enforce deterministic safety logic processing. Utilizing a triple modular redundancy (TMR) 2oo3 architecture, the hardware pairs three lockstep PowerPC microprocessors with continuous background self-checking routines and localized watchdog timers to block execution anomalies. Galvanic isolation barriers spanning 1500 V to 2500 V intercept fault currents from external interface loops, ensuring clean backplane communication and fulfilling fail-safe state execution metrics mandated for IEC 61508 SIL 3 certification.

Frequently Asked Questions

Q: How does the T9310-02 handle internal hardware discrepancies without tripping the system?

A: The processor utilizes internal Hardware Implemented Fault Tolerant (HIFT) processing. If one of the three lockstep microprocessors reports data that deviates from the calculated 2oo3 safety matrix, the system logs a diagnostic fault while the remaining two processors maintain real-time, uninterrupted control of the safety loop.

Q: Is hot replacement of the primary controller supported without halting system communications?

A: Yes. The module features hot-swappable architecture. An active processor module can undergo slot removal and replacement while the system remains powered up, allowing the secondary redundant units to maintain execution of the core safety logic without inducing operational downtime.

Field Installation Guidelines

  • Chassis Engagement: Align the card guides with the target slot on the main backplane. Slide the module forward until the multi-pin connectors mate securely with the backplane, and tighten all grounding screws to verify structural continuity.
  • Shield Grounding Matrix: Connect all communication and expansion shield drains directly to the central marshaling panel ground terminal. Ensure ground path resistance does not exceed 1 Ohm to prevent common-mode voltage spikes.
  • Cable Handling Limits: Route connected communication and extension bus cables through isolated, low-voltage control trays. Maintain a minimum separation of 30 cm from high-power AC lines or heavy inductive electrical switches.
  • Thermal Constraints: Maintain open ventilation pathways at the top and bottom sections of the module assembly. Verify that internal enclosure air movement maintains ambient operating temperatures inside the -20 deg C to +60 deg C limits.

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