GE Fanuc IC695CPU315 RX3i PacSystem CPU Module

Disponibilidad: 10 Quedan en stock

The GE Fanuc IC695CPU315, also cataloged as the IC695CPU315 Central Processing Unit (CPU) Module, operates as a dedicated hardware component...

Código: IC695CPU315

Manufacturer: GE Fanuc
Product No.: IC695CPU315
Product Type: CPU Processors
Product Origin: USA
Payment:T/T, Western Union
Weight: 790g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

The GE Fanuc IC695CPU315, also cataloged as the IC695CPU315 Central Processing Unit (CPU) Module, operates as a dedicated hardware component for logic processing and communication management within RX3i PacSystem platforms.

Hardware Specifications

Parameter	Specification
Model	IC695CPU315
Brand	GE Fanuc Emerson
Origin	United States
Weight	0.79 kg (1.75 lbs)
Dimensions	Standard 2-slot width
Operating Temp	Industry standard 0 to 60 deg C (ambient)
Power Consumption	1,750 mA at 3.3 VDC / 1,200 mA at 5 VDC
Processor Speed	1 GHz
Memory Type	Flash and Static Random-Access Memory (SRAM)
User Memory Capacity	20 MB
Communication Ports	1x RS-232, 1x RS-485
Backplane Support	Universal backplane only
Occupied Slots	2 backplane slots
Max Local Racks	8
Max Program Blocks	512
Boolean Execution Speed	0.047 ms per 1,000 words
Supported Protocols	Serial I/O, Secure Network Programming (SNP), Modbus RTU Slave
Programming Languages	Function Block Diagram, Structured Text, Ladder Logic, C

Backplane Bus Communication Velocity and Deterministic Networks

The module interfaces directly with the RX3i universal backplane, leveraging high-speed backplane bus communication velocity to manage data exchange across local I/O modules. It coordinates deterministic networks via specific expansion modules, ensuring synchronous I/O density scaling up to 8 local racks. Firmware flash compatibility allows field updates to the processor control logic without structural hardware changes, maintaining strict adherence to timing constraints across all execution loops.

Frequently Asked Questions

Q: What are the restrictions regarding the installation of this module on the backplane?

A: The module requires 2 dedicated slots on an RX3i universal backplane. It cannot be installed on standard or legacy expansion backplanes. Power requirements must be verified against the backplane power supply capacity, as it draws 1,750 mA at 3.3 VDC and 1,200 mA at 5 VDC simultaneously.

Q: Can the firmware of this CPU module be upgraded in the field?

A: Yes, firmware flash compatibility allows direct updates via the built-in communication ports. The firmware must match the version requirements of the system configuration software to prevent hardware mismatch faults.

Field Installation Guidelines

Ensure all system power is completely disconnected before inserting or removing the module from the universal backplane to prevent electrical damage to the pins.
Align the module with the designated 2 slots on the universal backplane and press firmly until the chassis connectors are fully seated.
Secure the module screws to ensure mechanical stability and proper ground continuity with the backplane frame.
For communication ports (RS-232/RS-485), use shielded twisted-pair cables. Terminate the cable shields at the ground bar to prevent electrical noise interference on serial lines.

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