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The GE IC697CPX935, also cataloged as the IC697CPX935 CPU Module, serves as the primary IC697CPX935 Central Processing Unit utilized to execute real-time logic calculations and interface synchronization across Series 90-70 platforms. The hardware resides in a single backplane slot to govern physical and electrical signal data transfers over a VME C.1 compliant network backplane.

Hardware Specifications

Parameter Specification
Model IC697CPX935
Brand GE Fanuc Emerson
Origin USA
Weight 0.45 kg (1.00 lbs)
Dimensions Single-slot rack width
Operating Temp 0 to 50 deg C (requires active forced-air cooling)
Power Consumption 15.5 W (3.1 A @ 5 VDC input)
Microprocessor 80486DX4 (96 MHz clock speed)
Logic Execution Speed 0.4 microseconds per Boolean instruction
Volatile Memory 1 MB battery-backed CMOS RAM
Non-Volatile Memory 256 KB Flash Memory (for system firmware)
Discrete I/O Capacity 12 K points maximum (any combination of inputs/outputs)
Analog I/O Capacity 8 K Words maximum
Serial Communications 1x RS-232 (Port 1), 2x RS-485 (Port 2 and Port 3 via 9-pin D-shell)
Serial Protocol Profiles SNP Slave (all ports), Break-Free SNP Slave (Port 1 and Port 2)
Battery Backup Hardware IC697ACC701 Lithium Battery assembly

Industrial Control and Network Determinism

The IC697CPX935 enforces rigid execution profiles through specific firmware flash compatibility matrices embedded directly within its non-volatile sector, allowing internal code updates without physical EPROM modification. The 32-bit internal pipeline maintains stable I/O density scaling up to 12,000 discrete points and 8000 analog points while preventing backplane bus communication velocity degradation. Processing blocks operate under deterministic timelines over VME C.1 channels to interface with companion LAN links and intelligent option cards without introducing calculation jitter.

Frequently Asked Questions

Q: What are the specific thermal dependencies and cooling infrastructure configurations required for this processor?

A: The IC697CPX935 requires continuous active forced-air cooling when operated up to its 50 deg C ambient ceiling. Installation requires integration with a dedicated rack fan assembly such as the IC697ACC721 (120 VAC), IC697ACC724 (240 VAC), or IC697ACC744 (24 VDC).

Q: Does this module support unpowered hot-swapping or physical manipulation under live backplane power?

A: No. The Series 90-70 backplane cannot mitigate transients during live insertions. The entire chassis must be electrically isolated from the primary 5 VDC rail prior to removing or seating the CPU to prevent localized logic destruction or user program register wipe.

Field Installation Guidelines

  • Active Cooling Fan Placement: Mount the chosen matching rack fan assembly directly beneath the physical slot location containing the CPU to guarantee uniform convective heat dissipation across the 96 MHz microprocessor surface.
  • Redundant Battery Installation: Connect the external IC697ACC701 lithium cell to the front-facing battery leads prior to removing primary rack power to maintain data retention for the 1 MB internal RAM space.
  • Serial Link Shielding Isolation: Terminate the outer metal braided shield of all 9-pin D-shell RS-485 connections directly to the chassis ground frame. Keep data lines separated from primary three-phase motor or power distribution pathways to suppress high-frequency noise injection.

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