MDK2-S1 Yokogawa MDK2 Series Datasheet & Technical Manual

MDK2-S1 Yokogawa CENTUM VP CPU Control Card

MDK2-S1 Yokogawa CENTUM VP CPU Control Card

Disponibilidad: 10 Quedan en stock

Yokogawa MDK2-S1 Control Processor Module The Yokogawa MDK2-S1, also cataloged as the MDK2 Control Processor Module, serves as the primary...

Código: MDK2-S1

Manufacturer: Yokogawa
Product No.: MDK2-S1
Product Type: Control Processor Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 350g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

Yokogawa MDK2-S1 Control Processor Module

The Yokogawa MDK2-S1, also cataloged as the MDK2 Control Processor Module, serves as the primary MDK2 Control Processor Module utilized to execute regulatory, sequence, and batch control logic across Field Control Units (FCUs) within CENTUM VP and CS 3000 architectural networks. The hardware operates as the primary processing element, executing real-time data arbitration and managing hardware interrupts through direct integration with the system backplane interface.

Hardware Specifications

Parameter	Specification
Model	MDK2-S1
Brand	Yokogawa
Origin	Japan
Weight	0.35 kg
Dimensions	120 mm x 25 mm x 130 mm
Operating Temp	0 to 60 deg C
Power Consumption	7.5 W (calculated from 5 VDC, 1.5 A)
System Compatibility	CENTUM VP, CS 3000
Processor	32-bit RISC CPU (~200 MHz)
Main Memory	64 MB (battery-backed)
Battery Backup	Up to 72 hours (recharge time ~48 hours)
Communication Protocols	Vnet/IP, ESB bus, ER bus
Isolation	1500 VAC (system-to-bus, 1 min)
Humidity Range	5 to 95% RH (non-condensing)

Distributed Process Control & Channel Isolation

The processing module establishes high-bandwidth synchronization routines via 100 Mbps Vnet/IP and localized ESB/ER bus infrastructures. To prevent system-wide ground potential deviations and block common-mode noise from corrupting core logic functions, the hardware incorporates internal galvanic channel-to-channel isolation circuits rated at 1500 VAC. A 32-bit RISC microcontroller coordinates complex algorithmic processing arrays inside a 64 MB volatile memory space, which retains execution states during power supply loss using an integrated battery backup circuit. Front-mounted physical LED arrays continuously verify hardware execution levels by indicating RUN status, communication states, and active hardware faults.

Frequently Asked Questions

Q: How does the MDK2-S1 synchronize control parameters when deployed in dual-redundant pairings?

A: The primary module maps and mirrors memory updates to the backup card over a dedicated high-speed bus track across the backplane. If the primary processor registers an internal hardware interrupt or a communication fault, the secondary card automatically triggers a bumpless takeover of all current regulatory and sequence control loops without dropping active I/O variables.

Q: What specific procedure must be followed regarding the memory backup battery during physical card replacement?

A: Field engineers must verify that the internal battery jumper is engaged on the replacement module before sliding it into the slot. Installing the card with the battery circuit open disables data retention, which prevents the 64 MB memory space from holding control parameters during any subsequent 5 VDC backplane power distribution failures.

Field Installation Guidelines

Chassis Insertion Vectors: Slide the card into the pre-assigned slot of the field control unit using the top and bottom guide rails of the subrack. Apply manual pressure perpendicular to the backplane until the system bus socket locks into place, then secure all retention fasteners to eliminate micro-arcing from ambient vibration.
Shield Ground Integrity: Terminate the outer copper braids of all communication and network cables directly at the master cabinet shield grounding rail. Ensure the shield layer remains ungrounded at any distributed field junction boxes to prevent the formation of localized electrical ground loops.
Convective Flow Spacing: Leave a clearance gap of no less than 50 mm above and below the horizontal boundary of the module rack. This clearance allows natural convective airflow through the enclosure, keeping the internal board temperature within the specified 0 to 60 deg C operating window.

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