SARM55C Yokogawa Terminal Board Digital Output Module

Disponibilidad: 99 Quedan en stock

Yokogawa SARM55C Terminal Board Configured for signal distribution and field device interfacing in CENTUM VP distributed control systems, the Yokogawa...

Código: SARM55C

Manufacturer: Yokogawa
Product No.: SARM55C
Product Type: Digital Terminal Boards
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 2200g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

Yokogawa SARM55C Terminal Board

Configured for signal distribution and field device interfacing in CENTUM VP distributed control systems, the Yokogawa SARM55C (SARM55C Terminal Board) provides direct physical signal routing for digital output operations.

Hardware Specifications

Parameter	Specification
Model	SARM55C
Brand	Yokogawa
Origin	Indonesia
Weight	2.2 kg
Dimensions	482.6 mm (W) x 132.5 mm (H) (3U)
Operating Temp	0 to 50 deg C
Power Consumption	Max. 0.65 A (24 V DC)
Relay Points	32-point output
Insulation Resistance	At least 10 MΩ (500 V DC)
Withstanding Voltage	2 kV (Field to Case/Power); 500 V (24 V Power to Case)

Process Control and Signal Isolation

The SARM55C serves as a mechanical relay interface, facilitating the transition between the Yokogawa FIO subsystem digital output modules and field-level actuators. To maintain signal integrity and ensure loop stability, the board utilizes dry contact switching. This architecture requires adherence to specific loop protocol constraints, particularly regarding inductive load suppression. When integrating with controllers such as the ADV551 or ADV561, engineers must account for the mechanical switching latency inherent in relay-based designs. Furthermore, the board provides galvanic isolation between the field device terminals and the internal 24 VDC control power rail, protecting the backplane from field-side transients.

Frequently Asked Questions

Q: Can the SARM55C be used for high-frequency pulse output applications?

A: No. The SARM55C utilizes mechanical relays which are subject to physical contact bounce and wear. High-frequency switching will significantly degrade the relay lifespan. Solid-state alternatives are recommended for high-speed pulse applications.

Q: Is the terminal board compatible with both single and redundant DO module configurations?

A: Yes. The board supports both single and dual-redundant module topologies, provided the correct interface cables (e.g., AKB331 or AKB337) are utilized to maintain signal mapping consistency.

Q: Does this board support hot-swapping?

A: The board itself is a passive terminal component. While the connected DO modules may support hot-swapping under specific system conditions, verify that all power to the associated field terminals is isolated before performing maintenance on the wiring.

Field Installation Guidelines

Mounting: Install the 3U unit within a standard 19-inch rack. Ensure sufficient clearance above and below the unit to allow for natural convection cooling, as the unit dissipates heat based on relay state and load current.
Grounding: Connect the chassis ground terminal to the main panel protective earth (PE) bus using a low-impedance copper conductor. This is necessary to maintain the effectiveness of the 2 kV withstand voltage rating.
Wiring: Utilize M4 screw terminals for all field connections. Torque specifications must follow standard industrial requirements to prevent connection heating under maximum load (2 A per point).
Shielding: Ensure that all shielded signal cables are terminated correctly at the ground bar to minimize electromagnetic interference (EMI), ensuring compliance with CE and C-Tick standards.

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