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Schneider Electric BMXP342020 Modicon M340 PLC CPU Module

Schneider Electric BMXP342020 Modicon M340 PLC CPU Module

Disponibilidad: 94 Quedan en stock

Schneider Electric BMXP342020 Modicon M340 Processor Module The Schneider Electric BMXP342020 serves as the primary BMXP342020 Processor Module utilized to...

Código: BMXP342020

Manufacturer: Schneider
Product No.: BMXP342020
Product Type: CPU Processors
Product Origin: France
Payment:T/T, Western Union
Weight: 450g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

Schneider Electric BMXP342020 Modicon M340 Processor Module

The Schneider Electric BMXP342020 serves as the primary BMXP342020 Processor Module utilized to execute complex programmable loops and multi-rack configurations across Modicon M340 series platforms. The hardware runs a dedicated internal logic engine that processes user application code, coordinates local and remote I/O data exchanges, and manages simultaneous communication streams over integrated serial, USB, and network interfaces.

Hardware Specifications

Parameter	Specification
Model	BMXP342020
Brand	Schneider Electric
Origin	France
Weight	0.45 kg (0.992 lb)
Dimensions	Compact single-slot Modicon M340 module format
Operating Temp	0 to 60 deg C
Power Consumption	5 W (1000 mA at 5 VDC from backplane bus)
Logic Memory	4 MB internal RAM
Maximum I/O Capacity	Up to 1024 discrete I/O, 128 analog I/O
Task Management Structure	1 master task, 1 fast task, 64 event tasks
Instruction Execution Time	0.12 us Boolean, 0.33 us word arithmetic, 2.5 us floating point
Integrated Communication Ports	1 x Ethernet TCP/IP, 2 x Serial (RS-232/RS-485), 1 x USB
Supported Protocols via Options	CANopen, Modbus, Profibus DP, AS-Interface
Memory Expansion	Dedicated SD card slot for program binary and data log storage
Enclosure Protection	IP20, Pollution Degree 2
Relative Humidity	10% to 95% operating (non-condensing)

Deterministic Network Routing and Backplane Scaling

The processor module dictates synchronization across the host chassis, governing the internal backplane bus communication velocity to ensure uniform I/O updates. It supports multi-rack I/O density scaling routines, enabling the real-time processing of complex multitasking application structures within deterministic limits. Integrated logic paths handle native bridging to Profinet / EtherNet/IP deterministic networks, maintaining direct firmware flash compatibility and continuous memory alignment during active execution of supervisory control routines.

Frequently Asked Questions

Q: How does the processor manage memory volatile states during an extended power outage if no backup battery is installed?

A: The processor utilizes internal RAM for active program execution, but relies on its internal non-volatile flash memory and the mandatory SD memory card expansion slot to retain the application binary. Upon power restoration, the hardware automatically reloads the compiled program from the non-volatile media into the runtime RAM space, resuming operation based on the predefined task parameters.

Q: What are the exact behavioral differences between the master task, fast task, and event tasks during execution?

A: The master task operates as the primary cyclic or periodic loop managing the main automation program. The fast task runs asynchronously with higher priority for time-critical logic, while the 64 event tasks interrupt all regular processing immediately upon a hardware or software trigger to execute subroutines within sub-millisecond response windows.

Q: Can optional network communication modules be configured or swapped on the backplane while the processor is in the RUN state?

A: No. While the backplane structure provides high isolation, adding or removing option modules like CANopen or Profibus cards changes the bus topology, requiring a full configuration download and processor power cycle to re-initialize hardware arbitration.

Field Installation Guidelines

Insert the processor module firmly into the designated first slot of a Modicon X80 backplane chassis, making sure the lower structural hook seats completely before snapping the upper tension latch into the metal grounding rail. Fasten all integrated terminal lock screws to guarantee continuous, low-impedance electrical bonding to the panel enclosure chassis ground plate. Maintain clear, unobstructed ventilation spaces above and below the rack assembly to sustain operating temperatures beneath the 60 deg C thermal saturation threshold.

All communication connections using the integrated RS-232/RS-485 serial ports and the Ethernet TCP/IP RJ45 interface must utilize shielded, twisted-pair cables rated for high-noise industrial facilities. Route these data buses inside distinct, grounded metal wire ways completely isolated from high-voltage AC motor lines, transformers, and power switching circuitry. Connect the cable shield wraps to the master instrumentation grounding busbar at a single point near the enclosure entries to prevent ground loop noise injection.

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