Yokogawa MDK1*B CENTUM VP CPU Control Card

Disponibilidad: 10 Quedan en stock

Yokogawa MDK1*B Control Processor Module Configured for high-speed network integration in industrial automation environments, the Yokogawa MDK1*B, also cataloged as...

Código: MDK1*B

Manufacturer: Yokogawa
Product No.: MDK1*B
Product Type: Control Processor Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 350g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

Yokogawa MDK1*B Control Processor Module

Configured for high-speed network integration in industrial automation environments, the Yokogawa MDK1*B, also cataloged as the MDK1 Control Processor Module, provides direct physical/electrical execution to run complex control strategies. The board functions as the central processing unit within field control units, executing regulatory, sequence, and batch control logic directly over the internal system backplane.

Hardware Specifications

Parameter	Specification
Model	MDK1*B
Brand	Yokogawa
Origin	Japan
Weight	0.35 kg
Dimensions	120 mm x 25 mm x 130 mm
Operating Temp	0 to 60 deg C
Power Consumption	7.5 W (calculated from 5 VDC, ~1.5 A)
Card Type	Control Processor Module / Printed Circuit Board
Processor Architecture	32-bit RISC CPU (~200 MHz clock speed)
Main Memory	64 MB (battery-backed, retains data during power loss)
Battery Backup Duration	Up to 72 hours (recharge time ~48 hours)
System Compatibility	CENTUM VP, CS 3000
Communication Protocols	Vnet/IP, ESB bus, ER bus
Electrical Isolation	1500 VAC (system-to-bus, 1 min)
Humidity Range	5 to 95% RH (non-condensing)

Process Control & System Bus Performance

The module coordinates multi-layer network topologies by integrating field control unit processors with Vnet/IP, ESB bus, and ER bus architectures. To prevent field-side voltage spikes from damaging the internal processing circuits, the hardware maintains a 1500 VAC galvanic isolation barrier between the system logic and the communication bus. The 32-bit RISC CPU handles deterministic arithmetic operations, drawing from 64 MB of volatile main memory sustained by a 72-hour battery backup unit during primary supply interruptions. Real-time system health parameters register through channel-to-channel monitoring paths, displaying runtime states via dedicated front-panel LEDs for RUN, FAIL, and active communication routines.

Frequently Asked Questions

Q: How does the MDK1*B maintain data integrity during a total power disruption on the 5 VDC rack supply?

A: The processor uses an onboard battery backup circuit to supply power to the 64 MB volatile main memory array when external operating power drops. The circuit retains stored regulatory parameters and batch configurations for up to 72 hours, recharging fully within 48 hours once primary rack power returns.

Q: What are the functional outcomes if a single processor module fails in a dual-redundant configuration?

A: The dual-redundant architecture pairs two identical CPU cards across the backplane bus. If the primary online unit encounters a hardware fault or triggers the front-panel FAIL LED indicator, the secondary card executes a bumpless takeover of all regulatory loops and batch logic within a single execution cycle, preventing control dropouts.

Field Installation Guidelines

Chassis Integration Alignment: Direct the card assembly into the specified field control unit rack slot using the top and bottom chassis guides. Push the module firmly until the multi-layer backplane connector seats completely into the mating bus receptacle, then tighten all physical lock screws to stop vibration-induced contact failure.
Battery Connection Check: Verify that the onboard memory backup battery jumper is set to the active position prior to sliding the card into the enclosure chassis. Installing the processor card with a disconnected battery loop disables memory retention features during unpowered states.
Wiring Duct Layout: Segregate all Vnet/IP and ESB bus communication cables from internal high-voltage AC distribution paths inside the cabinet. Keep a clear distance of at least 30 cm between signal wires and power leads to reduce electromagnetic noise coupling on the deterministic processor bus.

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