TSXP57303AM Schneider Electric PL7 CPU Module

TSXP57303AM Schneider Electric Modicon Premium PL7 CPU Module

TSXP57303AM Schneider Electric Modicon Premium PL7 CPU Module

Availability: 94 left in stock

Schneider Electric TSXP57303AM Modicon Premium CPU Module Configured for high-capacity discrete and analog processing in complex distribution networks, the Schneider...

SKU: TSXP57303AM

Manufacturer: Schneider
Product No.: TSXP57303AM
Product Type: CPU Processors
Product Origin: France
Payment:T/T, Western Union
Weight: 520g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Schneider Electric TSXP57303AM Modicon Premium CPU Module

Configured for high-capacity discrete and analog processing in complex distribution networks, the Schneider Electric TSXP57303AM, also cataloged as the TSXP57303AM CPU Module, provides direct physical and electrical execution. This double-format processor manages automated sequences and execution loops through specialized embedded software environments. Operating directly on the system backplane, the unit coordinates real-time field data across high-density industrial control topologies.

Hardware Specifications

Parameter	Specification
Model	TSXP57303AM
Brand	Schneider Electric
Origin	France
Weight	0.52 kg (1.15 lbs)
Dimensions	Double-format slot module
Operating Temp	0 to 60 deg C
Power Consumption	1000 mA at 5 VDC
Processor Capacity	Up to 1024 discrete I/O, 128 analog I/O
Software Compatibility	PL7 Junior / PL7 Pro
Execution Time	0.12 us Boolean (internal RAM), 2.5 us Floating Point
Internal RAM	64K words program and data
Communication Ports	2 x Non-isolated serial links (Mini-DIN, 19.2 to 115 kbit/s)
IP Rating	IP20
Certifications	CE, UL 508, CSA, IEC 61131-2, ABS, BV, DNV, GL

Backplane Bus Communication Velocity and Firmware Characteristics

This Schneider Electric processor optimizes bus data exchange rates to expedite backplane bus communication velocity across the rack assembly. The hardware structure allocates deterministic timing slots for integrated fieldbus interfaces, which ensures repeatable cycle times during peak signal loading. Through structured firmware flash execution routines, the processor maintains precise timing intervals during asynchronous communication requests. Technicians change system behavior safely because the memory layout permits dynamic I/O density scaling via external PCMCIA expansion slots.

Frequently Asked Questions

Q: How does the addition of a PCMCIA memory card alter the Boolean instruction execution speed?

A: The execution time changes from 0.12 us to 0.17 us per Boolean instruction when the processor references the application code directly from the PCMCIA expansion card interface instead of the standard internal RAM.

Q: What is the maximum physical distance and line status limitation for the integrated Mini-DIN serial connection links?

A: The non-isolated serial links support communication transfer speeds from 19.2 kbit/s up to 115 kbit/s, but because they lack galvanic isolation, you must strictly limit line routing to short-distance local terminal devices to prevent ground loop noise interference.

Q: What specific data buffering behavior occurs during a localized 5 VDC backplane power interruption?

A: The internal volatile RAM utilizes an integrated backup cell to protect the 64K words of program and data structure, which prevents application code corruption during unexpected main rack power disruptions.

Field Installation Guidelines

Engineers must mount the double-format module strictly within a compatible Modicon Premium rack slot assembly. Ensure the backplane power supply remains entirely offline during the mechanical insertion process to avoid voltage arc damage to the multi-pin connector interfaces.

Fix the module into the designated dual-slot footprint using the integrated locking mechanism at the base of the housing chassis. Maintain clear ventilation paths above and below the rack configuration to allow ambient air cooling, which keeps localized internal temperatures below the 60 deg C operating threshold.

Route all communication cabling through standard low-impedance shielded terminal lines. Terminate the outer braided shields directly at the central enclosure ground rail to suppress electromagnetic interference from adjacent high-voltage drive components.

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