Yokogawa F3SP28-3S Sequence CPU Module
The Yokogawa F3SP28-3S, also cataloged as the F3SP28 Sequence CPU Module, serves as the primary F3SP28 Sequence CPU Module utilized to execute sequence and logic control programs across FA-M3 PLC series platforms. The unit processes digital and analog control instructions utilizing a repetitive operation method based on a stored program system. It manages high-density logic execution and system task coordination by directly interfacing with peripheral input/output architectures mounted onto the shared system backplane.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | F3SP28-3S |
| Brand | Yokogawa |
| Platform | FA-M3 PLC Series |
| Origin | Japan |
| Weight | 300 g |
| Dimensions | 110 x 50 x 30 mm |
| Operating Temp | -20 to +60 deg C |
| Power Consumption | Powered via backplane (24 V DC system voltage) |
| CPU Processing Speed | 1.5 MIPS |
| Memory Capacity | 8 MB |
| I/O Refresh Method | Refresh method / direct I/O instruction execution |
| Number of I/O Points | Up to 2048 points supported (4096 points maximum hardware addressing limit) |
| Program Block Capacity | 1024 program blocks maximum |
| Programming Languages | Structured ladder language, mnemonic language, structured text, function block diagram |
| Cooling System | Natural convection |
| Operating Humidity | 5 to 95% RH (non-condensing) |
Distributed System Architecture and Backplane Communication
The processing unit relies on dedicated backplane bus communication velocity allocations to synchronize data structures across attached remote and local modules without processing bottlenecks. Internal registry configuration scales efficiently to handle broad I/O density scaling demands, allowing the processor to maintain consistent cycle times even under peak instruction loads. The hardware design preserves firmware flash compatibility parameters across the FA-M3 lifecycle, enabling deterministic field network updates while maintaining logic memory execution states across power interruption cycles.
Frequently Asked Questions
Q: Does this sequence CPU support direct online editing of the active program logic blocks?
A: Online program modifications are constrained by the memory allocation structure of the FA-M3 platform; the memory registers must be written using the direct I/O instruction set or through compatible programming interfaces that prevent execution timing drops.
Q: How does the unit maintain its memory mapping during a complete system power interruption?
A: The stored program logic and system configuration data are retained via the internal non-volatile memory structure, while real-time registers utilize backplane hardware backup paths to protect critical process states.
Q: Can the CPU module be hot-swapped while the base slot backplane is actively powered?
A: No. Removing or inserting the CPU module while the backplane power supply is live can induce voltage transients that damage the internal logic bus pins and corrupt active register tables.
Field Installation Guidelines
- Base Unit Slot Insertion: Align the module top and bottom guides carefully with the target base unit slot before applying horizontal force to prevent bending the high-density backplane connector pins.
- Grounding Matrix Continuity: Ensure the FA-M3 base unit chassis is bonded directly to a low-impedance industrial instrument ground to suppress high-frequency noise from interfering with the internal CPU bus line.
- Convection Clearance Allocation: Maintain a minimum clear boundary space of 50 mm above and below the module housing to facilitate natural convection cooling currents within the cabinet enclosure.
- Firmware Verification Routine: Confirm that the firmware compatibility revisions match the existing peripheral I/O modules installed on the rack before executing system startup logic routines.
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