BMXXBP1200 Schneider Electric 12-Slot Backplane

BMXXBP1200 Schneider Electric 12-Slot Backplane | New & Original Stock

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Schneider Electric BMXXBP1200 Modicon X80 12-Slot Backplane The Schneider Electric BMXXBP1200, also cataloged as the BMXXBP1200 Backplane, operates as a...

رمز المنتج: BMXXBP1200

Manufacturer: Schneider
Product No.: BMXXBP1200
Product Type: Backplane Modules
Product Origin: France
Payment:T/T, Western Union
Weight: 1270g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Schneider Electric BMXXBP1200 Modicon X80 12-Slot Backplane

The Schneider Electric BMXXBP1200, also cataloged as the BMXXBP1200 Backplane, operates as a dedicated hardware component for structural support and parallel bus data routing within Modicon M340 and Modicon X80 platform automation networks. This hardware chassis provides the physical slots and internal signal traces necessary to connect up to 12 modules, including central processing units, dedicated power supplies, network option modules, and discrete or analog field device interfaces. By executing local logic routing directly over an embedded Bus X infrastructure, this component serves as the underlying electrical backbone for modular automation configurations.

Hardware Specifications

Parameter	Specification
Model	BMXXBP1200
Brand	Schneider Electric
Origin	France
Weight	1.27 kg (Net weight), 1.317 kg (Package weight)
Dimensions	503.2 mm width x 103.7 mm height x 19.0 mm depth
Operating Temp	0 to 60 deg C
Power Consumption	0.17 W internal static power consumption
Chassis Slots	12 dedicated Bus X module slots
Product Compatibility	BMXP34 processors, BMXCPS power supplies, standard X80 I/O cards
Electrical Interconnect	1 x connector layout for XBE expansion modules
Fixing Mode	Mechanical fastening via 4 x M4, M5, or M6 screws on panels/plates
Relative Humidity	10 to 95 percent relative humidity non-condensing
IP Degree of Protection	IP20
Directives	2014/35/EU (Low Voltage), 2014/30/EU (Electromagnetic Compatibility)
Product Certifications	CE, UL 61010-2-201, CSA C22.2 No 61010-2-201, RCM, EAC, UKCA, Merchant Navy
Standards Compliance	EN/IEC 61131-2, EN/IEC 61010-2-201, IACS E10, EN/IEC 61850-3

Backplane Bus Communication Velocity and I/O Density Scaling

This backplane module features high-density I/O density scaling via integrated parallel Bus X lines capable of handling synchronous, high-speed data refreshes between the master processor and the field interfaces. The underlying electronic architecture maintains a low internal power consumption profile of only 0.17 W, directing almost all available backplane power from the power supply module directly to the connected instrumentation cards. For applications requiring multi-rack topologies, the single embedded expansion connector interface links seamlessly with XBE line extension cards, enabling the extension of the Bus X parallel communication line across multiple sequential chassis segments without introducing timing delays or reducing processing velocity.

Frequently Asked Questions

Q: Can the BMXXBP1200 backplane be mounted directly on a standard 35 mm DIN rail?

A: No. The BMXXBP1200 is engineered specifically for rigid panel or mounting plate installation using four mechanical M4, M5, or M6 screws. The structural weight of a fully populated 12-slot rack requires a flat, bolted layout to satisfy the 3 gn industrial vibration and shock resistance standards.

Q: How is backplane bus power distributed to modules inserted into slots 2 through 11?

A: Internal multi-layer copper busbars run horizontally along the rear assembly of the backplane. When a BMXCPS power supply is installed in the dedicated leftmost slot, it energizes these internal power traces, delivering regulated voltage directly to the interface pins of every adjacent module slot.

Q: What action must be taken if a specific module slot develops mechanical or electrical socket damage?

A: Individual slot connectors are permanently wave-soldered onto the internal master multi-layer printed circuit board during manufacturing. If an isolated socket is bent or electrically carbonized by an external field short-circuit, the complete backplane unit must be isolated and replaced to prevent parallel signal line disruptions.

Field Installation Guidelines

Mounting Plate Alignment: Mark and tap the four mounting holes on the back panel using the factory template, ensuring the plate surface is free of metal filings prior to positioning the chassis.
Module Torque Constraints: Slide each individual module into the backplane locating slots until it seats completely in the parallel socket, then hand-tighten the upper retention screw to fix the card against vibration.
Expansion Line Integration: When utilizing an XBE extension cable, verify that the parallel line connector pins are unbent before locking the interface hood into the single designated chassis expansion port.
Airflow Clearances: Maintain a strict physical safety clearance of at least 80 mm above and below the horizontal profile of the backplane to prevent heat traps from driving internal temperature configurations above the 60 deg C operating limit.

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