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Configured for multi-channel analog signal acquisition in PACSystems RX3i platforms, the GE Fanuc IC694ALG233 (IC694ALG233 Analog Current Input Module) provides direct physical/electrical execution.

Hardware Specifications

Parameter Specification
Model IC694ALG233
Brand GE Fanuc Emerson
Origin USA
Weight 0.81 lbs (0.37 kg)
Dimensions Single-slot RX3i module width
Operating Temp 0 to 60 deg C
Power Consumption 120 mA internal backplane power draw
Input Channels 16 single-ended channels
Signal Processing Analog current inputs
Data Format 16-bit signed integer
External Power Requirement 20 to 30 VDC
Storage Temp -40 to 100 deg C
Humidity Range 5% to 95% relative humidity (non-condensing)
Installation Altitude Up to 1000 m MSL

Backplane Bus Communication Velocity & I/O Density Scaling

The IC694ALG233 interface optimizes backplane bus communication velocity across PACSystems RX3i chassis layouts by transferring converted 16-bit integer values directly into the main CPU memory register table. High-density I/O density scaling allows up to 16 single-ended analog current channels to be continuously sampled within a single backplane slot. The module requires an external DC user supply between 20 and 30 VDC to power input loops, maintaining an internal current draw of 120 mA from the backplane supply. Firmware flash compatibility ensures seamless backplane address mapping during local rack execution or remote expansion drop execution.

Frequently Asked Questions

Q: What external power supply limits apply to the IC694ALG233 analog current input module?

A: The module requires an external user DC supply within the range of 20 to 30 VDC for input channel operation.

Q: How is analog measurement data formatted across the backplane bus?

A: Analog inputs are converted and converted into a 16-bit signed integer format for register processing by the RX3i CPU.

Q: What are the backplane current consumption characteristics for this module?

A: The module draws 120 mA of current directly from the internal RX3i backplane power bus.

Field Installation Guidelines

  1. Power down the RX3i backplane rack and de-energize external field current loop supplies before installing or removing the module.
  2. Align the module housing card edges with the targeted slot in the RX3i baseplate, pressing the unit firmly until the rear connector latches into the backplane bus.
  3. Tighten the top and bottom panel retention screws to secure the module mechanically and ensure continuous frame grounding.
  4. Route signal wires separately from high-voltage AC conductors using shielded twisted-pair wiring for all 16 single-ended input loops.
  5. Ground signal cable shielding at a single chassis ground point near the cabinet entry to prevent ground loop noise interference.

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