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The GE Fanuc IC694MDL940 serves as the primary IC694MDL940 Relay Output Module utilized to execute physical relay switching of field devices across PACSystems RX3i platforms. The module provides sixteen discrete normally open (Form A) contact outputs arranged in four isolated groups of four channels each, allowing control over external solenoids, motor starters, and indicators.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL940 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 0.37 kg (0.81 lbs) |
| Dimensions | 130 mm x 30 mm x 115 mm (Standard single-slot width) |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 7 mA @ 5 VDC (backplane), 135 mA @ 24 VDC (relay bus) |
| Output Channels | 16 (4 groups of 4 channels) |
| Contact Form | Form A (Normally Open) |
| Operating Voltage Range | 5 to 30 VDC or 5 to 250 VAC (50/60 Hz) |
| Maximum Switching Current | 2.0 A per point (pilot duty); 4.0 A maximum per common |
| Minimum Load | 10 mA |
| Maximum Inrush Current | 5.0 A |
| Response Time | 15 ms maximum (turn-on and turn-off) |
| Field to Backplane Isolation | 250 VAC continuous; 1500 VAC for 1 minute |
| Channel-to-Channel Isolation | 250 VAC continuous; 1500 VAC for 1 minute |
| Status Indicators | 32 LEDs (displays logic state of output channels) |
Backplane Integration & I/O Density Scaling
The IC694MDL940 interfaces directly with the PACSystems RX3i PCI backplane bus, executing high-velocity status transitions without adding communication latency. By packing 16 Form A relay outputs into a single-slot chassis width, the module optimizes rack-space density. It draws nominal operating power directly from the 5 VDC and 24 VDC backplane buses to actuate internal coils. To prevent signal interference, optocouplers provide electrical isolation between the internal RX3i logic circuits and the external high-voltage field wiring.
Frequently Asked Questions
Q: Does the IC694MDL940 include internal fuses to protect the output channels?
A: No, the module does not have internal fuses. External current-limiting fuses must be wired in series with the field outputs to protect the internal relay contacts from overcurrent and short-circuit faults.
Q: Can this module be hot-swapped under field power?
A: No, hot-swapping the module while the RX3i backplane or external field power is active is not supported and can cause damage to the backplane connectors or trigger unexpected state transitions. Power down both the PLC backplane and external field circuits before insertion or removal.
Q: What is the mechanical and electrical life expectancy of the relay contacts?
A: The relay contact lifespan ranges from 100,000 to 1,000,000 operations, heavily dependent on the operating voltage, load characteristics (inductive versus resistive), and current draw of the connected load.
Field Installation Guidelines
- Mounting & Position: Install the module into any standard I/O slot of a PACSystems RX3i backplane. Ensure the module is firmly seated and locked in place using the top and bottom chassis tabs.
- Wiring Separation: Route AC and high-voltage DC field wiring away from low-voltage communication and backplane bus cabling to prevent electrostatic coupling and electrical noise interference.
- Inductive Load Suppression: For inductive loads (e.g., solenoids, contactor coils), install external suppression circuits. Use a diode in parallel for DC circuits, or a resistor-capacitor (RC) snubber network in parallel for AC circuits.
- Grounding Requirements: Verify that the PACSystems RX3i chassis ground terminal is connected directly to a low-impedance earth ground. Ensure the field wiring arm shield drain wire is grounded correctly at the enclosure boundary.
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