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Configured for high-density backplane bus communication and module mounting in Rx7i System networks, the GE Fanuc IC698CHS009 (IC698CHS009 Rx7i PACsystem I/O Rack) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC698CHS009 |
| Brand | GE Fanuc |
| Origin | USA / As specified on label |
| Weight | Shipping weight: 4.0 kg |
| Dimensions | Standard Rx7i frame footprint |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Operating voltage: 5 to 12 VDC |
| Power Supply Rating | 100 W or 350 W power supply support |
| Current Rating | 20 A (with 100 W power) / 60 A (with 350 W power) |
| System Application | Rx7i System |
| Mounting Type | Rear mounting |
Backplane Bus Communication Velocity and Firmware Flash Compatibility
The IC698CHS009 rack provides low-resistance signal trace routing across the backplane structure to optimize backplane bus communication velocity among installed processing, communication, and I/O modules. Operating with internal voltage rails of 5 to 12 VDC, the assembly distributes up to 60 A backplane current when paired with a 350 W power supply unit (or 20 A with a 100 W power supply unit). This solid backplane power bus ensures signal integrity during firmware flash compatibility procedures across system controller components.
Frequently Asked Questions
Q: What current ratings apply to the IC698CHS009 backplane bus depending on the installed power supply unit?
A: The backplane bus supports a current rating of 20 A when utilizing a 100 W power supply unit, or up to 60 A when paired with a 350 W power supply unit.
Q: What are the primary operating voltage specifications for the IC698CHS009 backplane logic power distribution?
A: The internal backplane operates within a 5 to 12 VDC voltage range supplied directly by the chassis power supply module.
Field Installation Guidelines
- Mount the chassis securely against a rigid panel using rear mounting holes to verify mechanical grounding integrity across the frame.
- Verify total module current demands across the 5 VDC and 12 VDC backplane rails do not exceed the rating of the selected power supply unit before energizing system power.
- Maintain clean wire routing paths to prevent field conductor interference along the front module insertion tracks.
- Route ground bonding straps from the frame earth ground terminal directly to the enclosure main ground bus bar.
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