IC698CHS117 GE RX7i I/O Rack 18-Slot

GE IC698CHS117 Rx7i PACsystem I/O Rack

Disponibilidad: 10 Quedan en stock

The GE IC698CHS117, also cataloged as the IC698CHS117 PACSystems RX7i I/O Rack, operates as a dedicated hardware component for chassis...

Código: IC698CHS117

Manufacturer: GE Fanuc
Product No.: IC698CHS117
Product Type: I/O Racks
Product Origin: USA
Payment:T/T, Western Union
Weight: 5900g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

The GE IC698CHS117, also cataloged as the IC698CHS117 PACSystems RX7i I/O Rack, operates as a dedicated hardware component for chassis mounting and backplane bus distribution within Rx7i PACsystem networks. The structural assembly houses the mechanical tracking rails and electrical interconnects necessary to establish physical routing between processing elements and localized interface cards.

Hardware Specifications

Parameter	Specification
Model	IC698CHS117
Brand	GE Fanuc Emerson
Origin	USA
Weight	5.90 kg (13.00 lbs)
Dimensions	11.2 x 19.0 x 7.5 inches (H x W x D)
Operating Temp	0 to 60 deg C
Power Consumption	350 W maximum capacity
Backplane Bus	VME64 Integration Architecture
Total Available Slots	18 I/O slots plus 1 dedicated power supply slot (Slot 0)
Single Slot Width	0.8 inches
Power Supply Slot Width	2.6 inches
Current Rating Rails	60 A @ 5.0 VDC, 12 A @ 12 VDC, 4 A @ -12 VDC
Enclosure Requirement	Minimum IP 54 rating
Mounting Orientation	Rear wall vertical installation

Industrial Control and Network Determinism

The IC698CHS117 relies on an integrated VME64 backplane bus communication velocity layout to deliver four times the standard bandwidth capacity of conventional VME configurations. This enhanced electrical tracing layout ensures high-speed data propagation across localized points, allowing rapid I/O density scaling profiles without encountering standard transmission bottlenecks. Hardware addressing remains strictly software-defined through firmware flash compatibility routines, matching real-time module presence verification via automated slot-sensing traces directly embedded in the backplane PCB.

Frequently Asked Questions

Q: Can single-width and double-width hardware units be intermixed across slots 1 through 18?

A: Yes. The 18-slot architecture accepts variations of up to 15 standard single-width modules, 8 double-width modules, or a combined configuration of both layouts, provided Slot 1 is maintained for primary processing allocation.

Q: Does the VME64 backplane system support unpowered hot-swapping of I/O hardware?

A: No. The IC698CHS117 requires total power isolation via the main 350 W power supply module before physical cards are unseated or inserted into the chassis tracks to prevent permanent signal degradation on the data lines.

Field Installation Guidelines

Enclosure Specifications: Install the open-frame chassis within a secure industrial enclosure certified to a minimum rating of IP 54 to prevent atmospheric contamination or moisture intrusion from degrading exposed backplane components.
Electrical Supply Capacities: Ensure that maximum cross-module electrical loads do not exceed the specific current rail limitations of 60 A at 5.0 VDC and 12 A at 12 VDC delivered from the Slot 0 power supply unit.
Shield Grounding Methods: Secure the metallic backplate of the chassis straight to the structural master grounding terminal of the enclosure utilizing heavy-gauge copper braid to attenuate high-frequency electrical emissions and external noise.

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