IC694MDL732 GE RX3i Discrete Output Module

IC694MDL732 GE RX3i PACSystem Positive-Logic Output Module

IC694MDL732 GE RX3i PACSystem Positive-Logic Output Module

Disponibilidad: 10 Quedan en stock

The GE IC694MDL732, also cataloged as the IC694MDL732 Discrete Output Module, operates as a dedicated hardware component for field load...

Código: IC694MDL732

Manufacturer: GE Fanuc
Product No.: IC694MDL732
Product Type: Discrete Output Modules
Product Origin: USA
Payment:T/T, Western Union
Weight: 1360g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

The GE IC694MDL732, also cataloged as the IC694MDL732 Discrete Output Module, operates as a dedicated hardware component for field load driving within RX3i PACSystem platforms. The module sources DC power to field control loads through 8 discrete output points, converting controller backplane signals into 12-24 VDC output operations.

Hardware Specifications

Parameter	Specification
Model	IC694MDL732
Brand	GE Fanuc Emerson
Series	RX3i PACSystem
Product Type	Discrete Output Modules
Output Points	8 points (1 group)
Output Logic	Positive logic (sourcing)
Rated Voltage	12-24 VDC
Output Voltage Range	12-24 VDC
Output Current	0.5 A per point (2.0 A maximum per common)
Inrush Current	4.78 A for 10 ms
Response Time	2 ms maximum (On/Off)
Power Consumption	50 mA from backplane
Isolation	250 VAC continuous, 1500 VAC for 1 min
Status Indicators	8 LEDs (output state display)
Protection	None (no internal fuses)
Operating Temp	0 to 60 deg C
Dimensions	Single-slot RX3i module footprint
Weight	1.36 kg (3.00 lbs)
Origin	USA

Backplane Bus Interfacing and Deterministic Networks

The IC694MDL732 interfaces with the RX3i universal backplane bus to execute state updates dispatched from the CPU. High backplane bus communication velocity maintains deterministic cycle execution across all output points. Onboard firmware flash compatibility facilitates integration into existing rack configurations, enabling synchronized signal updates without interrupting adjacent system I/O routines.

Frequently Asked Questions

Q: Does the IC694MDL732 support hot-swapping during chassis operation?

A: Yes, the module supports hot-swap functionality, allowing physical insertion or removal from the RX3i backplane rack without interrupting system backplane power.

Q: Are there internal protective fuses built into the IC694MDL732 output channels?

A: No, the module contains no internal fuses or circuit breakers. External fuse protection must be provided on the field wiring lines.

Q: What is the maximum current rating per output point and per common group?

A: Each individual output point supports a continuous current rating of 0.5 A, with a maximum limit of 2.0 A across the shared common connection.

Field Installation Guidelines

Ensure external field supply voltage sources are de-energized or isolated before servicing terminal block connections.
Wear a grounded ESD wrist strap before handling the card frame to prevent static discharge to onboard electronics.
Align the module card guides with the target slot on the RX3i universal backplane and insert until the rear connector seats and locking tabs snap firmly.
Wire output field loads between the negative power bus and output terminals, installing external fast-acting fuses to protect against short circuits.
Apply power to external field supply terminals and verify channel status using the front-panel LEDs during output toggling.

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