The GE Fanuc IC695ECM850, also cataloged as the IC695ECM850 Ethernet Communication Module, operates as a dedicated hardware component for IEC 61850 protocol translation and switched network interfacing within PACSystems RX3i platforms.
| Parameter | Specification |
|---|---|
| Model | IC695ECM850 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 1.00 lbs (0.45 kg) |
| Dimensions | Single-slot RX3i module profile |
| Operating Temp | 0 to 60 deg C (derates to 57 deg C with 100 Mbps SFP or 1 Gbps copper SFP) |
| Power Consumption | 3.3 VDC: 1.2 A (no SFP), 1.9 A max (2 SFPs); 5 VDC: 1.1 A max |
| Network Ports | 4 switched ports (2 RJ-45 copper, 2 SFP cages) |
| Media Support | 10/100/1000 Mbps copper, 100/1000 Mbps single-mode / multi-mode fiber |
| Network Topology | Star and linear topologies |
| Addressing Limit | 1 IP address, up to 5 MAC addresses per module |
| System Capacity | Maximum 4 modules per RX3i CPU (main rack installation only) |
| CPU Compatibility | RX3i CPUs with firmware 8.05 or higher (CPE310, CPE305, CPU315, CPU320, CRU320) |
| Configuration Software | Proficy Machine Edition 8.0 SIM7 or later |
| Maintenance Interfaces | 1 Mini-USB port (CLI), 1 SD-card slot |
| Features | Hot-swappable, SNTP time synchronization |
The IC695ECM850 executes real-time data frame transmission over high-speed networks while optimizing backplane bus communication velocity across the RX3i chassis. Operating as an IEC 61850 client device, the module handles deterministic network routing between substation servers and the host controller. Integrated firmware flash compatibility ensures seamless operating updates without physical chip replacement, maintaining deterministic packet transfer and supporting I/O density scaling across complex multi-node architecture topologies.
Q: Can the IC695ECM850 module be hot-swapped during active system operation?
A: Yes. The IC695ECM850 is hot-swappable, allowing insertion or removal in the main RX3i rack without interrupting backplane power to adjacent operational modules.
Q: What are the backplane current draw requirements for the IC695ECM850?
A: At 3.3 VDC, the module draws 1.2 A without SFPs installed and up to 1.9 A with 2 SFP optical devices installed. At 5 VDC, the maximum current draw is 1.1 A.
Q: What restricts the physical rack placement and quantity of IC695ECM850 modules per system?
A: A single RX3i CPU supports up to 4 IC694/IC695 ECM850 modules, and all installed modules must reside exclusively within the main system rack.
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