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The GE IC698ACC720, also cataloged as the IC698ACC720 Faceplate, operates as a dedicated hardware component for physical slot sealing and electromagnetic interference containment within PACSystems RX3i chassis environments.

Hardware Specifications

Parameter Specification
Model IC698ACC720
Brand GE
Origin United States
Weight 1.45 lbs (0.66 kg)
Dimensions Double-slot module width layout
Operating Temp 0 to 60 deg C
Power Consumption 0 W (Passive hardware assembly)
Shielding Type Shielded construction
Package Quantity Pack of 6 units

Backplane Bus Communication Velocity & I/O Density Scaling

As a passive mechanical component, this hardware contains no active electronics and operates entirely without backplane bus communication velocity licences. However, the installation of shielded double-slot faceplates directly influences local rack environmental integrity. By closing unpopulated slot openings, the component stabilizes the interior forced-air thermal pathway required to sustain high-velocity bus transactions. It protects adjacent active hardware from electrostatic discharge (ESD) and physical debris, facilitating stable configuration profiles across maximum I/O density scaling limits.

Frequently Asked Questions

Q: Can these faceplates be installed or removed while the host chassis backplane is energized?

A: Yes. Since this is a passive mechanical component with no electrical interfaces, it supports removal and insertion while under power without causing bus logic errors or electrical disruptions to operational modules.

Q: What is the purpose of the integrated shielding on this double-slot component?

A: The shielded architecture serves to complete the continuous Faraday cage structure of the enclosure when empty slots exist, preventing electromagnetic radiation from corrupting the high-speed data packets on the backplane bus.

Q: Does this faceplate require any firmware configuration or software allocation within the hardware configuration table?

A: No. The item is entirely mechanical and is not recognized by the operating system or system firmware, requiring no entry in the PLC memory or peripheral configuration mapping.

Field Installation Guidelines

  • Chassis Alignment: Align the faceplate true with the empty slots of the universal chassis, ensuring the structural tabs line up correctly with the upper and lower mounting profiles.
  • Securing Mechanisms: Fasten the integrated retaining screws into the rack framing to secure the plate, preventing accidental displacement due to industrial floor vibrations.
  • Shielding Continuity: Ensure that the grounding fingers or conductive contact points on the shielded plate make firm, unpainted contact with the metal chassis to achieve proper electrostatic dissipation.
  • Storage and Handling: Keep uninstalled components in their original package of 6 units until required for field maintenance or rack reconfiguration to preserve the structural alignment of the sealing edges.

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