IC697MDL750 GE Discrete Output Module

GE Fanuc IC697MDL750 Series 90-70 Discrete Output Module

GE Fanuc IC697MDL750 Series 90-70 Discrete Output Module

التوفر: 10 متوفر في المخزون

Configured for discrete electrical load switching in Series 90-70 networks, the GE IC697MDL750 (IC697MDL750 Discrete Output Module) provides direct physical/electrical...

رمز المنتج: IC697MDL750

Manufacturer: GE Fanuc
Product No.: IC697MDL750
Product Type: Digital I/O Cards
Product Origin: USA
Payment:T/T, Western Union
Weight: 650g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Configured for discrete electrical load switching in Series 90-70 networks, the GE IC697MDL750 (IC697MDL750 Discrete Output Module) provides direct physical/electrical execution of solid-state switching arrays. The single-slot module distributes positive logic signals across 32 independent field endpoints via an integrated high-density removable terminal connection matrix.

Hardware Specifications

Parameter	Specification
Model	IC697MDL750
Brand	GE Fanuc Emerson
Origin	USA
Weight	0.65 kg (1.44 lbs)
Dimensions	Single-slot rack width
Operating Temp	0 to 60 deg C
Power Consumption	1.25 W (0.25 A @ 5 VDC backplane draw)
Nominal Output Voltage	24 / 48 VDC
Output Voltage Range	20 to 60 VDC
Channel Count	32 (Arranged in 4 groups of 8 channels)
Current Rating	0.5 A per point / 2.0 A per group max
Maximum Inrush Current	10 A for 20 ms
On/Off Response Time	1 ms maximum
Output Voltage Drop	1.0 V maximum
Off-State Leakage Current	1 mA maximum
Backplane Isolation	1500 VAC (Optical)
Group-to-Group Isolation	500 VAC

Industrial Control and Network Determinism

The IC697MDL750 utilizes standard backplane bus communication velocity protocols compliant with VME standard C.1 to route localized channel updates. The internal electronic configuration supports independent I/O density scaling profiles, ensuring that multi-group 24/48 VDC driving commands perform without inducing logic processing jitter. Integrated mechanical keying structures prevent mismatched firmware flash compatibility variables from destabilizing peripheral power rails during physical unit replacements.

Frequently Asked Questions

Q: Does the IC697MDL750 support hot-swapping under active backplane power conditions?

A: No. The Series 90-70 rack architecture lacks the hardware components required for unpowered insertion. Power isolation of the hosting chassis must be executed prior to physical installation or extraction to prevent voltage transients on the 5 VDC logic bus.

Q: What is the purpose of the integrated mechanical keying track on the housing assembly?

A: The mechanical keying strip forces unique physical engagement matching. This profile blocks alternative voltage or module varieties from being seated into the slot allocated for the 20-60 VDC output assembly, neutralizing accidental high-voltage cross-connections.

Field Installation Guidelines

Terminal Board Wire Gauge Allocations: Secure field wiring loads into the removable terminal assembly using a minimum of #22 AWG (0.36 mm2) up to a maximum of #14 AWG (2.10 mm2) wire pairs. Ensure no more than two conductors are secured to an individual terminal clamp screw.
Inductive Load Suppression: When interfacing the 0.5 A channels with inductive field components like solenoid-actuated valves or motor starters, place external flyback diodes across the physical loads to quench surge voltages and protect the output switches.
Common Grounding Standards: Verify that individual return wires for each of the four separate isolated channel groups are tied back to their independent power references, observing the 500 VAC group-to-group isolation margins.

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