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The GE IC697MEM715, also cataloged as the IC697MEM715 Expansion Memory Board, operates as a dedicated hardware component for memory expansion within Series 90-70 PLC platforms.

Hardware Specifications

Parameter Specification
Model IC697MEM715
Brand GE Fanuc Emerson
Origin USA / Global Manufacturing
Weight 0.11 kg (0.25 lbs)
Dimensions Series 90-70 Daughterboard Form Factor
Operating Temp 0 to 40 deg C (32 to 104 deg F)
Power Consumption Power supplied via host module connection
Series Series 90-70
Product Type Expansion Memory Boards
Memory Capacity 128 KB
Memory Technology Encapsulated CMOS RAM
Storage Temp 0 to 50 deg C (32 to 122 deg F)
Operating Humidity 80% non-condensing
Maximum Altitude 1000 m above sea level

Backplane Bus Communication Velocity and Network Integration

The IC697MEM715 integrates directly onto the main CPU logic card, extending local CMOS user memory capacity by 128 KB without introducing additional backplane bus communication velocity latency. Direct board-level bus interfaces allow high-speed instruction fetches and data table read/write cycles directly synchronized with the processor core.

Firmware flash compatibility across supported Series 90-70 CPU revisions ensures rapid module recognition and immediate address space allocation. The expansion board topology facilitates modular I/O density scaling and memory expansion for large logic programs and data logging buffers without requiring additional backplane slot occupancy.

Frequently Asked Questions

Q: How is the 128 KB CMOS RAM on the IC697MEM715 physically mounted in the system?

A: The board attaches directly to the host Series 90-70 CPU module as a memory expansion daughterboard rather than occupying a separate backplane slot.

Q: Does the IC697MEM715 require an onboard battery for data retention?

A: No. The encapsulated CMOS memory relies on the host CPU module or rack power supply battery backup circuit to maintain retained data during system power outages.

Q: What are the environmental operating limits for this memory expansion board?

A: The board is rated for operation between 0 and 40 deg C (32 to 104 deg F) with relative humidity up to 80% non-condensing.

Field Installation Guidelines

  • Always power down the host rack chassis and disconnect power before removing the CPU module to install or replace the memory daughterboard.
  • Use a grounded ESD wrist strap during installation to prevent electrostatic discharge damage to sensitive CMOS logic devices.
  • Align the board connector pins precisely with the host CPU module header before applying gentle, even pressure to seat the board.
  • Ensure all mechanical standoffs or retaining clips engage properly to secure the daughterboard against mechanical vibration.
  • Reinstall the CPU module, restore power, and verify via system software that the full 128 KB extended memory space is recognized.

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