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Configured for physical protection of unpopulated baseplate slots in Series 90-30 chassis, the GE IC693ACC310 (IC693ACC310 Filler Module) provides direct physical enclosure containment.

Hardware Specifications

Parameter Specification
Model IC693ACC310 (also references IC694ACC310 cross-compatibility)
Brand GE Fanuc / Emerson
Origin Factory standard
Weight 0.11 kg (0.25 lbs)
Dimensions Single-slot mechanical footprint
Operating Temp Standard industrial limits (0 to 60 deg C equivalent)
Power Consumption 0 mA (No backplane current draw)
Slot Width Single slot
Supply Voltage None
Backplane Connection Non-electrical physical fitment only
LED Indicators None
Baseplate Compatibility IC693CPU311, IC693CPU313, IC693CPU323, IC693CHS397, IC693CHS391, IC693CHS398, IC693CHS392, IC693CHS399, IC693CHS393
Hot-Swap Execution Supported (No backplane current interruption)

Backplane Isolation and I/O Density Scaling

The module functions strictly as a non-electrical mechanical barrier to maintain chassis structural integrity and fulfill environmental isolation mandates. By populating unassigned chassis slots, it prevents the entry of conductive dust, moisture, and chemical particulates into adjacent exposed backplane connectors. Because the hardware contains no active logic gates or semiconductor components, it exhibits zero impact on the host backplane bus communication velocity and does not modify the master I/O density scaling maps. The absence of electrical traces ensures that insertion or removal has no loading effect on the deterministic networks of the active baseplate.

Frequently Asked Questions

Q: Can this module be inserted or removed while the host PLC rack is energized?

A: Yes. Because the module does not establish electrical contact with the backplane bus pins and draws 0 mA of current, insertion and removal under power are supported without risk of bus voltage dips or communication faults.

Q: Is configuration or software I/O tagging required within the programming environment?

A: No. The unit contains no active electronic circuitry or internal registers. It is transparent to the CPU and requires no allocation in the hardware configuration matrix or programming software.

Q: Does the module contain status LEDs or terminal block assignments?

A: No. The front faceplate is entirely blank, featuring no LED status indicators, module labels, or provisions for terminal block engagement.

Field Installation Guidelines

  • Inspect the vacant baseplate slot to ensure the physical guide tracks and the rear connector recess are clear of debris.
  • Align the mechanical plastic guides of the module with the top and bottom channels of the target empty chassis slot.
  • Slide the unit into the slot horizontally, maintaining parallel alignment with adjacent active I/O modules.
  • Press the module firmly into the chassis until the top and bottom structural retention latches snap and lock onto the baseplate frame.
  • When executing insertion or removal in operating environments prone to sustained mechanical vibration or shock, support adjacent wiring harnesses to prevent unintended displacement.

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