IC695CHS016 GE PACSystem RX3i Datasheet & Technical Manual

GE IC695CHS016 PACSystem RX3i Universal Backplane

GE IC695CHS016 PACSystem RX3i Universal Backplane

Disponibilidad: 10 Quedan en stock

The GE IC695CHS016, also cataloged as the IC695CHS016 Universal Backplane, operates as a dedicated hardware component for module connectivity and...

Código: IC695CHS016

Manufacturer: GE Fanuc
Product No.: IC695CHS016
Product Type: Universal Backplanes
Product Origin: USA
Payment:T/T, Western Union
Weight: 2070g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

The GE IC695CHS016, also cataloged as the IC695CHS016 Universal Backplane, operates as a dedicated hardware component for module connectivity and internal communication execution within PACSystem RX3i networks.

Hardware Specifications

Parameter	Specification
Model	IC695CHS016
Brand	GE Fanuc Emerson
Origin	USA
Weight	4.56 lbs (2.07 kg)
Dimensions	601.98 mm (w) x 141.5 mm (h) x 147.32 mm (d)
Operating Temp	0 to 60 deg C (Standard industrial range)
Power Consumption	600 mA at 3.3 VDC and 240 mA at 5 VDC internal load
Number of Slots	16 slots
Bus Interface	Integrated PCI bus and High-speed serial bus
Input Voltage	+24 VDC (Isolated input connection via TB1)
Input Terminals	Terminal 7: Isolated 24 VDC, Terminal 8: Isolated ground
Recommended Wire Size	14 to 22 AWG
Mounting Orientation	Horizontal only
Required Clearance	102 mm (4 inches) on all sides
Enclosure Protection	NEMA/UL Type 1 (IP20 minimum rated subpanel enclosure)

Backplane Bus Communication Velocity and I/O Density Scaling

The chassis incorporates a dual-bus subsystem backplane structure that establishes simultaneous routing for PCI signaling and legacy serial communications. This arrangement facilitates multi-generation I/O density scaling, allowing the 16-slot frame to host both PACSystem RX3i architectures and Series 90-30 discrete or analog components. Backplane bus communication velocity is optimized through direct data plane traces, preventing performance degradation when multiple high-density communication modules execute parallel processing routines across the system rack.

Frequently Asked Questions

Q: Does the IC695CHS016 backplane support active hot-swapping of modules during system operation?

A: Yes. The mechanical bus connectors support hot-swapping functionality for compatible hardware modules. This allows maintenance personnel to remove or insert I/O components without disrupting the internal communications or shutting down power to adjacent active slots.

Q: How is the physical space allocated for modules requiring wider footprints, such as AC power supplies?

A: The 16 slots are uniform in geometry, but specialized modules (e.g., high-capacity AC power supply modules) will physically occupy two adjacent slots. The physical backplane configuration must be configured in the software logic to reflect the correct slot utilization matrix.

Field Installation Guidelines

Mechanical Placement: Install the backplane strictly in a horizontal orientation inside the enclosure panel. Fasten the chassis securely to the metal subpanel using standard mounting hardware through the integrated mounting holes.
Environmental Clearances: Maintain a rigid minimum clearance boundary of 102 mm (4 inches) on all top, bottom, and side panels of the rack to allow natural convection air currents to cool the mounted modules.
Grounding and Power Input: Connect the incoming isolated +24 VDC power supply to Terminal 7 of the TB1 strip, and terminate the isolated ground to Terminal 8. Utilize the integrated grounding bar and a low-impedance ground strap bonded directly to the enclosure earth system to suppress electrical transients.

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