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The GE IC697ALG320, also cataloged as the IC697ALG320 Analog Output Module, operates as a dedicated hardware component for digital-to-analog signal conversion within Series 90-70 platforms.

Hardware Specifications

Parameter Specification
Model IC697ALG320
Brand GE Fanuc
Origin USA
Weight 2.00 lbs (0.91 kg)
Dimensions Single-slot baseplate form factor
Operating Temp 0 to 60 deg C
Power Consumption 8.3 W maximum (1.66 A at 5 VDC from backplane)
Number of Channels 4 individually configured outputs
Voltage Output Range -10 VDC to +10 VDC (bipolar)
Current Output Range 0-20 mA, 4-20 mA (default), 0 to 22.2 mA max range
DAC Resolution 16-bit resolution (14-bit monotonicity)
Sequential Update Rate 2.0 ms for all 4 channels
External User Power 150 mA at 24 VDC nominal (10 to 30 VDC range)
Voltage Temperature Coefficient 25 ppm per deg C
Current Temperature Coefficient 50 ppm per deg C
Calibration Data Storage Non-volatile onboard EEPROM

Backplane Bus Communication Velocity and Firmware Compatibility

The module executes synchronous data mapping across the Series 90-70 backplane, matching high-speed CPU sweep intervals to achieve a 2.0 ms total channel update cycle. Onboard configuration parameters, user scaling matrices, and diagnostic logic interact directly with the main processor register assembly. The non-volatile EEPROM safeguards factory calibration offsets and firmware flash compatibility frameworks against backplane power loss conditions.

Frequently Asked Questions

Q: What are the specific electrical load limitations for the analog outputs?

A: When configured for voltage operations, the channel requires a minimum resistive load of 2000 ohms and a maximum capacitive load of 1000 picofarad. For current operations, the loops support resistive loads up to 700 ohms, capacitive loads up to 1.0 microfarad, and inductive loads up to 250 milliHenry.

Q: How does the module handle short circuits or field wiring faults?

A: The voltage and current loops are designed with continuous short-circuit protection. Upon physical resolution of the field fault or shorted line, the affected circuit automatically recovers and returns to its normal calibrated operating execution state without requiring a hardware or rack reset.

Q: What is the maximum physical module density per baseplate?

A: System architecture rules permit a maximum configuration of 7 modules inside a primary CPU rack and up to 8 modules within a standard expansion rack baseplate, enabling a scalable density up to 252 discrete output channels.

Field Installation Guidelines

  • Baseplate Insertion: Verify that rack power is completely disconnected. Slide the module into a single open slot of a 5-slot or 10-slot baseplate, ensuring correct alignment with the backplane connectors before fully seating.
  • Field Wiring and Power: Wire the external 24 VDC field side power supply to the designated terminals to enable the 4-20 mA current loops. Run analog signal lines using individual twisted-shielded pairs.
  • Shield Grounding: Terminate all signal shields at the designated chassis ground bar inside the enclosure. Maintain strict physical separation between low-voltage analog cables and high-voltage AC power lines to minimize induced transient interference.

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