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The GE IC693MDL742, also cataloged as the IC693MDL742 Discrete Output Module, operates as a dedicated hardware component for solid-state switching of external direct current loads within Series 90-30 platforms.

Hardware Specifications

Parameter Specification
Model IC693MDL742
Brand GE Fanuc
Origin Factory standard
Weight 0.26 kg (0.56 lbs)
Dimensions Single-slot chassis occupancy
Operating Temp 0 to 60 deg C
Power Consumption 130 mA at 5 VDC (backplane bus, all outputs active)
Channel Density 16 output points
Output Grouping 2 isolated groups (8 channels per group)
Nominal Output Voltage 12 / 24 VDC
Output Signal Range 12 to 24 VDC (+20%, -15%)
Current Rating per Point 1.0 A maximum
Current Rating per Group 4.0 A at 50 deg C / 3.0 A at 60 deg C
Maximum On-State Voltage Drop 1.2 VDC
Maximum Off-State Leakage Current 1 mA
Maximum Response Time (On / Off) 2 ms
Field-to-Logic Isolation 1500 VDC
Group-to-Group Isolation 500 VDC
Relative Humidity 5 to 95% (non-condensing)

Deterministic Networks and I/O Density Scaling

The module controls field actuation loads by linking 16 positive-logic discrete outputs to the central controller via the parallel backplane bus structure. To manage heat generation and maintain hardware stability during maximum I/O density scaling inside the rack, the electronic subsystem limits its logic current draw to 130 mA from the 5 VDC rail. Optical couplers establish a 1500 VDC isolation barrier between the logic components and the field circuits, while group-to-group isolation is rated at 500 VDC. This electrical separation blocks inductive switching noise and prevents field-side electrical spikes from interfering with backplane bus communication velocity or disturbing execution cycles.

Frequently Asked Questions

Q: Does this module support dynamic hot-swapping or live replacement under power?

A: No. The Series 90-30 backplane architecture does not feature live-insertion capability. Main chassis power and external field loop power must be fully isolated before extraction or insertion of the module to prevent backplane component damage.

Q: How does ambient temperature affect the maximum current handling capacity of the output groups?

A: The current rating undergoes thermal derating based on internal heat sink dissipation profiles. Each group of eight outputs handles up to 4.0 A at an operating temperature up to 50 deg C, which drops to a maximum of 3.0 A per group when operating temperatures reach 60 deg C.

Q: Can different external voltages be sourced for the two separate output groups?

A: Yes. Because the module splits the 16 outputs into two isolated groups with 500 VDC group-to-group isolation, each group has its own separate electrical path and can use distinct DC power supplies within the 12 to 24 VDC range.

Field Installation Guidelines

  • Shut off all primary power supplying the PLC chassis rack and de-energize external field load supply lines prior to installation.
  • Locate an unpopulated I/O slot in a compatible local, expansion, or remote Series 90-30 baseplate.
  • Align the physical housing edges with the top and bottom card guides of the chosen slot and slide the module straight back.
  • Press firmly until the top and bottom plastic retention latches securely engage the edge of the chassis rail.
  • Route all DC field load wires through a dedicated wire duct that is physically separated from high-voltage AC cables by at least 30 cm to reduce inductive coupling.
  • Connect external flyback diodes across inductive DC field loads (such as solenoids or contactors) to suppress voltage spikes during output state transitions.

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