Configured for high-density 24 VDC output switching in CompactLogix and MicroLogix 1500 systems, the Allen-Bradley 1769-OB16P (1769-OB16P Digital Output Module) provides direct physical/electrical execution across 16 sourcing channels. It delivers power to field solenoids, indicator lamps, and control relays directly from the system power supply bus while maintaining high isolation against backplane surge propagation.
| Parameter | Specification |
|---|---|
| Model | 1769-OB16P |
| Brand | Allen-Bradley / Rockwell Automation |
| Origin | USA |
| Weight | 0.28 kg |
| Dimensions | 118 mm x 35 mm x 87 mm |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | 225 mA at 5.1 VDC backplane power |
| Output Type | 16 Sourcing Digital Outputs |
| Operating Voltage Range | 20.4 VDC to 26.4 VDC (Nominal 24 VDC) |
| Current Rating | 1.0 A per point / 8.0 A max per module |
| Backplane Isolation | 750 VDC (Field side to System side) |
| Connection Type | Removable Terminal Block (RTB) |
| Certifications | UL, CE, cULus, Class I Div 2 |
The module interfaces with the CompactLogix local chassis via high-velocity backplane bus communication drivers, allowing continuous state updating across all 16 output channels without cyclic scan delays. Advanced solid-state driver circuitry provides high I/O density scaling alongside robust channel protection against inductive kickback spikes. Furthermore, firmware flash compatibility across CompactLogix and distributed EtherNet/IP adapter banks ensures deterministic signal processing without packet latency during active execution cycles.
Q: Can the 1769-OB16P module be hot-swapped while the CompactLogix controller rack is powered?
A: No. The 1769 Compact I/O platform does not support Removal and Insertion Under Power (RIUP). Power to the backplane bus and field-side 24 VDC terminals must be completely isolated prior to removing or installing the module.
Q: What is the maximum current capacity per point on the 1769-OB16P compared to standard models?
A: The 1769-OB16P supports up to 1.0 A per point (with an 8.0 A maximum module total load), whereas standard output modules like the 1769-OB16 limit individual channel outputs to 0.5 A.
Q: How does field wiring isolation protect the system backplane?
A: An integrated galvanic barrier provides 750 VDC isolation between field-side output terminals and system-side logic circuits, preventing external ground faults or voltage spikes from causing backplane bus failure.
Disconnect all primary electrical power to the system rack and field devices before installing or wiring the 1769-OB16P module. Mount the housing directly onto a grounded 35 mm DIN rail or subpanel using appropriate mounting hardware, verifying that adjacent Compact I/O modules lock firmly into place using the built-in tongue-and-groove side latches. Wire the Removable Terminal Block (RTB) using copper conductors rated for the expected field load current, ensuring that 24 VDC power supply leads connect with correct polarity. Route output power lines away from sensitive communication cables and low-voltage analog inputs, maintaining at least 150 mm separation to reduce electromagnetic interference (EMI). Torque all terminal block screws per manufacturer standards, verifying at least 5 full thread engagements before snapping the terminal cover shut.
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