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The GE Fanuc DS200SLCCG3ADC, also cataloged as the DS200SLCC Base Model LAN Communications Card, operates as a dedicated hardware component for local area network signal processing within Mark V Turbine Control System platforms.

Hardware Specifications

Parameter Specification
Model DS200SLCCG3ADC
Brand GE Fanuc
Origin USA
Weight Less than 1.0 lb
Dimensions Standard Mark V PCB Form Factor
Operating Temp 0 to 60 deg C
Power Consumption Backplane Driven via Drive Control Interface
Onboard Processor LAN Control Processor (LCP)
Memory Configuration 2 x Removable EPROM Cartridges (LCP Program Storage)
Inter-Board Interface Dual-Ported RAM to Drive Control Board
Signal Architecture Isolated and Non-Isolated Communication Circuits
User Interface Attachable Alphanumeric Keypad Programmer
Connectors 9-Pin 2PL Connector
Revision Level Group 3, Revisions A, D (Functional), C (Artwork)

Backplane Bus Communication & Firmware Compatibility

The GE Fanuc DS200SLCCG3ADC processes local area network protocols using an onboard LAN Control Processor (LCP). The module utilizes dual-ported RAM to interface directly with the drive control board, enabling high-velocity backplane communication without restricting main processor processing cycles. Program code is maintained via two removable EPROM cartridges, ensuring firmware execution parity across connected drives and Power Supply Interface Boards (including IMCP, DCI, DCFB, and SDCI modules). Isolated and non-isolated circuitry configurations prevent ground loop propagation across deterministic industrial drive communication networks.

Frequently Asked Questions

Q: How does the DS200SLCCG3ADC communicate with the main drive control board?

A: The onboard LAN Control Processor (LCP) interfaces with the main drive control board through dedicated dual-ported RAM, allowing dual-directional data transfer without blocking backplane control loops.

Q: What protection measures exist for the onboard display during installation?

A: The PCB includes four mechanical standoff posts designed to protect the display evacuation point (the top glass seal of the display assembly) from physical impacts or mechanical stress.

Q: What is the significance of the "ADC" suffix on the part number?

A: The "ADC" suffix indicates three factory modifications applied to the base DS200SLCCG3 platform: functional revision A, functional revision D, and artwork revision C.

Field Installation Guidelines

  1. ESD Handling: Handle the printed circuit board exclusively at static-safe workstations. Personnel must wear grounded wrist straps connected to a verified ground point before removing the module from its anti-static packaging.
  2. Mounting: Position the card onto the mounting standoffs within the drive cabinet. Ensure the four protective posts around the display assembly remain aligned and unbent during physical insertion.
  3. Connector Alignment: Align the 9-pin 2PL cable connector straight on without angling to prevent pin bending. Ensure all retention screws or side latches engage completely.
  4. Wiring & Isolation: Separate isolated communication signal wiring from non-isolated lines and high-voltage AC power conductors. Maintain shield wire continuity and land shields at the designated cabinet earth grounding bar.

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