ASR133-S00 Yokogawa CENTUM VP Datasheet & Technical Manual

Yokogawa ASR133-S00 subsystem communication interface module

Yokogawa ASR133-S00 subsystem communication interface module

Availability: 10 left in stock

Yokogawa ASR133-S00 Subsystem Communication Interface Module The Yokogawa ASR133-S00-S1, also cataloged as the ASR133-S00 Subsystem Communication Interface Module, operates as...

SKU: ASR133-S00

Manufacturer: Yokogawa
Product No.: ASR133-S00
Product Type: Communication Interface Modules
Product Origin: Japan
Payment:T/T, Western Union
Weight: 500g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Yokogawa ASR133-S00 Subsystem Communication Interface Module

The Yokogawa ASR133-S00-S1, also cataloged as the ASR133-S00 Subsystem Communication Interface Module, operates as a dedicated hardware component for bridging field communication between the Field Control Station (FCS) and external third-party subsystem controllers within CENTUM VP/CS network platforms.

Hardware Specifications

Parameter	Specification
Model	ASR133-S00
Brand	Yokogawa
Origin	Japan
Weight	0.5 kg
Dimensions	3.8 x 12.7 x 15.2 cm
Operating Temp	-10 deg C to +55 deg C
Power Consumption	~300-400 mA (5 VDC)
Communication Rate	Up to 1 Mbps
Redundancy	Supported (Dual module)
Isolation	Optical/Electrical

DCS Process Control & Connectivity

The ASR133-S00 facilitates data exchange via proprietary link protocols, enabling the integration of external packaged units into the primary DCS environment. The module implements optical and electrical isolation to decouple the internal system bus from external field-side subsystems, preventing electrical disturbances from impacting control processing. Support for dual-module redundancy ensures high availability, allowing for seamless switchover in the event of a primary interface fault during continuous process execution.

Frequently Asked Questions (FAQ)

Q: Does the ASR133-S00 support hot-swapping during active operation?

A: In redundant configurations, the secondary module may be replaced without interrupting communication if the primary module maintains active status. Ensure the module is properly seated and initialized before initiating a diagnostic test or re-integrating into the redundant pair.

Q: How is data throughput managed when interfacing with third-party controllers?

A: The module manages data packets at speeds up to 1 Mbps. System integrators must ensure that the communication scan rates on the external subsystem do not exceed the buffer capacity of the ASR133-S00 to prevent data latency or dropped frame errors.

Field Installation Guidelines

Physical Mounting: Install the module into the designated I/O nest slot. Ensure the locking mechanisms are engaged to maintain secure connection to the backplane.
Communication Cabling: Utilize shielded, twisted-pair cabling for subsystem connections to reduce electromagnetic interference. Terminate shields at the cabinet ground bus, ensuring a low-impedance path to ground to prevent common-mode noise.
Redundancy Setup: When implementing a dual-module configuration, verify that both units are firmware-synchronized via the system engineering software before activating the link to the external subsystem.
Environment Check: Confirm that ambient cabinet temperature remains within the specified -10 deg C to +55 deg C range. Avoid mounting the module directly above high-heat generating components to ensure stable electronic performance.

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