The Yokogawa AND50-562, also cataloged as the AND50-562 RIO Bus Interface Card, operates as a dedicated hardware component for high-speed remote I/O serial communication within Yokogawa distributed control systems.
| Parameter | Specification |
|---|---|
| Model | AND50-562 |
| Brand | Yokogawa |
| Origin | Japan |
| Weight | 0.3 kg |
| Dimensions | 100 mm x 120 mm x 25 mm |
| Operating Temp | -20 to +60 deg C |
| Power Consumption | 24 VDC / 5 VDC backplane supply |
| Module Type | Dual-Redundant RIO Bus Interface Unit |
| Communication Protocol | RIO bus high-speed serial protocol |
| Transmission Speed | 128 Mbps |
| I/O Capabilities | 16 digital points, 8 analog points |
| Isolation Voltage | 1500 VAC withstand voltage |
| Mounting Options | 19-inch rack mountable or DIN rail mountable |
The interface card routes high-speed data streams between Field Control Units (FCU) and remote I/O station nodes across dual-redundant bus paths (Bus A and Bus B). Integrated signal conditioning provides 1500 VAC channel-to-channel and system galvanic isolation to mitigate ground loops and electromagnetic noise. This maintains transmission integrity for primary process variables, including 4-20 mA HART loop protocol signals and temperature inputs requiring digital cold junction compensation (CJC).
Q: How does the module handle communication failure on an active bus line?
A: Internal hardware logic continuously monitors communication link health across Bus A and Bus B. If signal loss or data corruption occurs on the active channel, the card initiates an automatic hardware switchover to the secondary redundant path without disrupting I/O process execution.
Q: What are the primary installation requirements for maintaining galvanic isolation?
A: Secure the card via its integrated rack or DIN rail mounting brackets, ensuring the metal grounding shield bonds directly to the enclosure protective earth. Field wiring and serial bus lines must remain physically separated from high-voltage AC cables to prevent induced noise on low-level signal paths.
Ensure main power feeds are completely de-energized prior to inserting or removing the card from the interface nest. Align the board edges with the guide rails and push firmly to seat the backplane multi-pin connector. Tighten all retaining screws to establish low-impedance ground bonding and prevent mechanical disengagement under vibration. Terminate serial bus communication cables with approved matching connectors, observing strict single-point shield grounding protocols at the cabinet entry point.
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