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GE Fanuc IC670ALG230 Field Control I/O

Configured for high-density single-ended analog data capture in distributed Genius Bus networks, the GE Fanuc IC670ALG230 (IC670ALG230 Analog Current Input Module) provides direct physical/electrical execution. This hardware component converts 0-20 mA or 4-20 mA loop currents into 12-bit digital data across eight single-ended channels. The module executes signal digitized conversion within 60 microseconds per channel and forwards these data bits directly to the head-end Bus Interface Unit (BIU). A 1500 VAC electrical barrier isolates the field-side loops from the internal processing architecture to block transient surges.

Hardware Specifications

Parameter Specification
Model IC670ALG230
Brand GE Fanuc
Origin USA
Weight 0.26 kg
Dimensions Standard Field Control footprint
Operating Temp 0 to 60 deg C
Power Consumption 51 mA maximum from BIU backplane
Number of Channels 8 (Single-ended)
Input Signal Range 0.0 mA to 25.0 mA
Digital Resolution 12-bit (5.0 uA per LSB)
Conversion Time 60 microseconds per channel
Input Impedance 250 ohms
External Power Supply 24 VDC (18-30 VDC range)
Isolation 1500 VAC (1 minute), 250 VAC (Continuous)
Non-linearity plus or minus 0.025% of full scale
Accuracy plus or minus 0.05% of full scale at 25 deg C

Industrial Control Backplane and Network Integration

The module implements software-selectable 50 Hz or 60 Hz digital notch filters to reject ambient industrial electrical noise from corrupting data registers. Backplane bus communication velocity handles the continuous stream of 12-bit processed values, matching the module-level conversion latency. Users scale I/O density by slot configuration on the local Field Control basebook. Firmware flash compatibility rules require that the head-end Bus Interface Unit recognizes the device hardware ID to maintain appropriate network synchronization across the deterministic distributed Genius Bus topology.

Frequently Asked Questions

Q: How does the module react if an external 24 VDC loop power supply drops below 18 VDC?

A: The hardware detects the undervoltage fault, ceases valid conversion cycles, and drives corresponding diagnostic failure bits to the BIU over the backplane bus.

Q: Can the internal analog-to-digital matrix withstand continuous high-voltage spikes?

A: The module maintains continuous galvanic isolation up to 250 VAC. Transient exposures up to 1500 VAC are withstood for a maximum duration of 1 minute without destruction of internal components.

Q: Does the 250 ohm input impedance require an external precision shunt resistor?

A: No, the 250 ohm precision termination resistors are completely integrated into the physical circuit layout of each individual input channel.

Field Installation Guidelines

  • Secure the module onto the Field Control baseplate terminal unit, verifying full mechanical engagement of the backplane connectors.
  • Route all 4-20 mA analog signal wires through dedicated, shielded twisted-pair cables to mitigate electromagnetic coupling.
  • Ground the overall cable shield at one single end on the chassis ground rail to prevent the generation of ground loop currents.
  • Ensure external 24 VDC loop power connections conform to the specified 18-30 VDC hardware operational window.

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