The GE Fanuc IC694CHS398, also cataloged as the IC694CHS398 Serial Expansion Backplane, operates as a dedicated hardware component for multi-slot rack extension and serial bus interconnection within PACSystem RX3i networks.
| Parameter | Specification |
|---|---|
| Model | IC694CHS398 |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.57 kg (1.25 lbs) |
| Dimensions | Compact 5-slot expansion chassis |
| Operating Temp | 0 to 40 deg C |
| Power Consumption | 0.85 W (170 mA at 5 VDC internal draw) |
| Slot Capacity | 5 slots |
| Operating Voltage | 5 VDC |
| Operating Humidity | 80% (non-condensing) |
| Storage Humidity | 80% (non-condensing) |
| Storage Temp | 0 to 40 deg C |
| Installation Altitude | Up to 1000 m MSL |
The IC694CHS398 expansion baseplate extends overall system I/O density scaling by providing 5 additional module slots linked directly to the main CPU rack via serial expansion cabling. Integrated bus trace routing maintains deterministic backplane bus communication velocity across all populated slots without transmission latency. Internal circuit architecture utilizes 170 mA at 5 VDC for logic supply distribution, maintaining signal stability and firmware flash compatibility across installed serial expansion modules.
Q: What are the primary power requirements for the IC694CHS398 serial expansion backplane logic circuits?
A: The backplane logic draws an internal operating current of 170 mA at 5 VDC, resulting in a total baseplate power consumption of 0.85 W.
Q: How many I/O module slots are available on the IC694CHS398 expansion unit?
A: The IC694CHS398 provides 5 physical module slots for hosting compatible RX3i and Series 90-30 expansion modules.
Q: What environmental temperature limits apply to the operation and storage of this backplane?
A: Both the operating temperature range and storage temperature range are specified from 0 to 40 deg C with maximum 80% non-condensing relative humidity.
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