Configured for high-density sinking load control in PACSystems RX3i backplane architectures, the GE Fanuc IC697MDL752 (IC694MDL752 Discrete Output Module) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL752 |
| Brand | GE Fanuc Emerson |
| Origin | USA |
| Weight | 0.50 lbs (0.23 kg) |
| Dimensions | Single-slot RX3i module width |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 1.3 Watts maximum (260 mA maximum at 5 VDC backplane bus) |
| Output Channels | 32 discrete points (4 isolated groups of 8 channels) |
| Operating Voltage Range | 4.75 to 5.25 VDC (TTL mode) / 10.2 to 28.8 VDC (12/24 VDC mode) |
| Output Current Sinking | 25 mA per point (TTL mode) / 0.5 A per point (12/24 VDC mode) |
| Group Load Capacity | 3.0 A maximum per group common / 4.0 A maximum per group |
| On-State Voltage Drop | 0.4 VDC maximum (TTL mode) / 0.24 VDC maximum (12/24 VDC mode) |
| Maximum Response Time | 0.5 ms (On and Off transitions) |
| Maximum Inrush Current | 4.6 A for 10 ms |
| External Terminal Interface | Two 24-pin Fujitsu FCN-365P024-AU connectors |
| Status Display | 32 individually numbered green LED indicators |
Backplane Bus Communication Velocity & I/O Density Scaling
The IC694MDL752 module interface is engineered to optimize backplane bus communication velocity across PACSystems RX3i chassis environments. Backplane current consumption scales dynamically up to a maximum draw of 260 mA at 5 VDC, governed by the base load plus active channel and LED status states (13 mA base + 3 mA per active channel + 4.7 mA per LED). High-density I/O scaling is achieved through two 24-pin Fujitsu connectors, enabling 32 points of isolated point-to-point output execution in a single rack slot. Firmware flash compatibility ensures seamless backplane address mapping during local CPU rack execution or within remote distributed I/O drop configurations.
Frequently Asked Questions
Q: What is the maximum allowable backplane current draw for the IC694MDL752 module from the 5 VDC rack bus?
A: The module draws up to 260 mA maximum from the 5 VDC backplane bus, calculated as 13 mA base current plus 3 mA per active channel and 4.7 mA per illuminated LED.
Q: Can different output groups on the same module operate at different voltage levels simultaneously?
A: Yes, each of the 4 isolated groups has an independent group common, allowing one group to operate in 5 VDC TTL mode while other groups run on 12 VDC or 24 VDC external user supplies.
Q: What pre-wired cabling accessories are compatible with the dual 24-pin front connectors?
A: The dual Fujitsu FCN-365P024-AU connector array interfaces directly with GE Fanuc pre-wired cable assemblies IC694CBL327 and IC694CBL328.
Field Installation Guidelines
- Isolate primary rack backplane power and de-energize all field load supply lines before inserting or removing the module from the RX3i chassis.
- Align the circuit board edges with the target RX3i backplane slot guides and slide the unit firmly into place until the rear backplane connector fully seats.
- Wire external DC user supplies to the group commons using correct polarity, ensuring negative logic (sinking) wiring rules are maintained across all output points.
- Install pre-wired cables (IC694CBL327/328) or custom harnesses onto the dual 24-pin Fujitsu connectors, ensuring side locking latches engage to prevent mechanical disconnection.
- Route signal wiring away from high-voltage AC cables and ground all cable shields at a single point near the enclosure entry to maintain signal integrity.
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