Configured for discrete load switching and positive logic field output driving in PACSystems RX3i platforms, the GE Fanuc IC694MDL753 (IC694MDL753 High Density Discrete Output Module) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL753 |
| Brand | GE Fanuc / Emerson |
| Origin | USA / As specified on hardware label |
| Weight | 0.56 lbs (0.26 kg) |
| Dimensions | Standard single RX3i I/O slot width |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 260 mA maximum @ 5 VDC (backplane bus load) |
| Output Channels | 32 Channels (4 groups of 8 channels each) |
| Operating Voltage | 12/24 VDC nominal (10.2 to 28.8 VDC range) |
| Wiring Logic | Positive logic (sourcing) |
| Output Current | 0.5 A per point; 4 A maximum per group |
| On-State Voltage Drop | 0.3 VDC maximum |
| Off-State Leakage Current | 0.1 mA maximum |
| Maximum Response Time | 0.5 ms (ON and OFF states) |
| Field-to-Backplane Isolation | 250 VAC continuous; 1500 VAC for 1 minute |
| Group-to-Group Isolation | 50 VAC continuous; 500 VAC for 1 minute |
| Compatible Wiring Cables | IC694CBL327 / IC694CBL328 pre-wired cables |
Backplane Bus Communication Velocity and I/O Density Scaling
The IC694MDL753 features high I/O density scaling across 32 discrete positive logic channels mapped into 4 distinct isolated output groups. Operating with a maximum switching response time of 0.5 ms, the module processes fast logic state execution without degrading backplane bus communication velocity. Internal logic draws a maximum of 260 mA from the 5 VDC backplane bus, while optical isolation provides up to 250 VAC continuous protection between field-side load circuits and backplane control logic.
Frequently Asked Questions
Q: What are the external power supply current requirements per group for the IC694MDL753? A: When all eight outputs in a group are ON, the user power supply current draw per group is up to 16.5 mA maximum at 24 VDC, or up to 9.6 mA maximum at 12 VDC.
Q: What pre-wired cable assemblies are compatible with the IC694MDL753 module connectors? A: The IC694MDL753 connects to high-density terminal blocks or field panels using IC694CBL327 or IC694CBL328 pre-wired cable options.
Field Installation Guidelines
- Fully de-energize the baseplate backplane and external 12/24 VDC field power sources prior to inserting or removing the module from an RX3i I/O slot.
- Ensure proper connection of external user power supplies to the common power pins for each of the four isolated output groups.
- Secure pre-wired cable assemblies (IC694CBL327 or IC694CBL328) into the front connector interface using integrated strain relief hardware to ensure electrical contact stability.
- Route output signal lines away from high-voltage AC conductors to limit external electrical noise coupling into the 12/24 VDC field output circuits.
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