The GE Fanuc IC694MDR390, also cataloged as the IC694MDR390 Mixed I/O Module, operates as a dedicated hardware component for discrete signal processing and relay actuation within PACSystems RX3i rack architectures.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDR390 |
| Brand | GE Fanuc |
| Origin | United States |
| Weight | 0.3 kg |
| Dimensions | 14.5 cm x 3.4 cm x 14.0 cm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 24 VDC nominal bus load |
| Discrete Inputs | 8 channels (24 VDC sink/source) |
| Relay Outputs | 8 channels (Form-A normally open) |
| Physical Isolation | Galvanic channel-to-backplane isolation |
| System Interface | Integrated backplane connector with supplementary RJ-45 / SFP ports |
| Compliance | UL, CE, ATEX, ABS, BV, DNV, GL, KRS, LR |
Backplane Bus Communication Velocity and Determinism
The IC694MDR390 interface circuit utilizes high-speed parallel backplane communication to maintain low-latency discrete update cycles across the PACSystems RX3i chassis. Input state data and output coil control words are synchronized within defined execution frames, ensuring deterministic state transition timings. Internal logic isolation circuitry isolates backplane processing logic from field-side voltage transients up to standard isolation ratings, preventing electromagnetic noise coupling into adjacent RX3i processing and communication modules.
Frequently Asked Questions
Q: Does the IC694MDR390 support hot-swapping under powered conditions?
A: Module insertion and removal must occur only when backplane power is removed or when the PACSystems RX3i chassis is configured to support Hot Swap (Insertion/Removal Under Power) per GE Fanuc RX3i installation standard operating procedures.
Q: How are discrete input channel states filtered against relay inductive spikes?
A: Integrated optocoupler circuitry maintains galvanic isolation between field inputs and backplane bus logic, suppressing inductive transients and common-mode voltage fluctuations.
Field Installation Guidelines
Ensure total system power is isolated before mounting the module onto the PACSystems RX3i backplane slot. Align the board edges with the chassis card guides and push firmly until the rear connector seats fully into the backplane receptacle. Field wiring for the 24 VDC input channels and Form-A relay output contacts must use stranded copper conductors rated for standard panel temperature thresholds. Route field signal cabling through dedicated raceways, maintaining separation from high-voltage AC distribution power cables to minimize capacitive cross-talk. Ground all shield drain wires at a single chassis ground bus terminal using short, low-impedance connections.
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