Configured for temporary hold-up power generation in PACSystems RX3i networks, the GE Fanuc IC695ACC412 (IC695ACC412 Cap Pack Module) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695ACC412 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 6.80 kg (15.00 lbs) |
| Dimensions | Enclosure compliant with NEMA/UL Type 1 standards |
| Operating Temp | Industry standard 0 to 60 deg C (ambient) |
| Power Consumption | Passive energy storage device |
| System Platform | PACSystems RX3i |
| Functional Execution | Temporary holdup voltage to preserve volatile memory |
| Local Interface | 1 green STAT LED indicator |
| Electrical Connection | Integrated 1 meter controller link cable |
| Mechanical Mounting | DIN rail assembly or panel top surface placement |
| Enclosure Rating | IP20 |
| Pollution Degree | Pollution Degree 2 |
Profinet / EtherNet/IP Deterministic Networks and I/O Density Scaling
The device functions within high-availability topologies alongside specialized CPU energy packs, maintaining continuous hardware operations across Profinet / EtherNet/IP deterministic networks during localized voltage dips. It feeds power directly into the processing unit during input dropouts, ensuring backplane bus communication velocity remains stable long enough to save data parameters. This targeted retention mechanism isolates internal tracking structures from runtime data collapse during extensive I/O density scaling routines, guaranteeing that firmware flash compatibility blocks are preserved until safely committed to non-volatile registers.
Frequently Asked Questions
Q: What operational status is verified by the single green STAT LED indicator?
A: The green STAT LED monitors the baseline charge state and hardware integrity of the internal capacitor banks. A solid illumination confirms the capacitance matrix is pressurized to the correct target threshold and is ready to deliver holding current.
Q: Can this hardware assembly be installed directly adjacent to high-heat dissipation modules?
A: No. To prevent thermal degradation of the internal storage components, the unit requires a strict minimum physical clearance of 25 mm (1 inch) on all sides to allow proper convection and heat dissipation.
Field Installation Guidelines
- Terminate all power feeds going to the RX3i chassis frame prior to mounting or handling the external capacitance device.
- Fix the unit onto an EN50022 compliant DIN rail, or position it directly at the designated bottom base section of the master energy pack assembly.
- Verify that the 1-meter controller cable is securely plugged into the matching port interface on the host CPU or energy pack module.
- Maintain a clean enclosure perimeter matching the Pollution Degree 2 rating, ensuring no conductive airborne particulates enter the IP20 vent openings.
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