Configured for discrete electrical load switching in Series 90-70 networks, the GE IC697MDL750 (IC697MDL750 Discrete Output Module) provides direct physical/electrical execution of solid-state switching arrays. The single-slot module distributes positive logic signals across 32 independent field endpoints via an integrated high-density removable terminal connection matrix.
| Parameter | Specification |
|---|---|
| Model | IC697MDL750 |
| Brand | GE Fanuc Emerson |
| Origin | USA |
| Weight | 0.65 kg (1.44 lbs) |
| Dimensions | Single-slot rack width |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 1.25 W (0.25 A @ 5 VDC backplane draw) |
| Nominal Output Voltage | 24 / 48 VDC |
| Output Voltage Range | 20 to 60 VDC |
| Channel Count | 32 (Arranged in 4 groups of 8 channels) |
| Current Rating | 0.5 A per point / 2.0 A per group max |
| Maximum Inrush Current | 10 A for 20 ms |
| On/Off Response Time | 1 ms maximum |
| Output Voltage Drop | 1.0 V maximum |
| Off-State Leakage Current | 1 mA maximum |
| Backplane Isolation | 1500 VAC (Optical) |
| Group-to-Group Isolation | 500 VAC |
The IC697MDL750 utilizes standard backplane bus communication velocity protocols compliant with VME standard C.1 to route localized channel updates. The internal electronic configuration supports independent I/O density scaling profiles, ensuring that multi-group 24/48 VDC driving commands perform without inducing logic processing jitter. Integrated mechanical keying structures prevent mismatched firmware flash compatibility variables from destabilizing peripheral power rails during physical unit replacements.
Q: Does the IC697MDL750 support hot-swapping under active backplane power conditions?
A: No. The Series 90-70 rack architecture lacks the hardware components required for unpowered insertion. Power isolation of the hosting chassis must be executed prior to physical installation or extraction to prevent voltage transients on the 5 VDC logic bus.
Q: What is the purpose of the integrated mechanical keying track on the housing assembly?
A: The mechanical keying strip forces unique physical engagement matching. This profile blocks alternative voltage or module varieties from being seated into the slot allocated for the 20-60 VDC output assembly, neutralizing accidental high-voltage cross-connections.
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