Configured for 12/24 VDC discrete signal switching in VersaMax I/O systems, the GE IC200MDL750 (IC200MDL750 Discrete Output Module) provides direct physical/electrical execution. The module drives up to 32 positive logic (sourcing) discrete output points, split into 2 isolated groups of 16 channels each. Operable within an output voltage range of 10.2 to 30 VDC, each channel delivers 0.5 A of nominal load current with a maximum inrush current capability of 2.0 A for 100 ms. Channel response times are maintained at 0.2 ms for ON transitions and 1.0 ms for OFF transitions to execute deterministic binary control for field loads.
| Parameter | Specification |
|---|---|
| Model | IC200MDL750 |
| Brand | General Electric |
| Origin | USA |
| Weight | 0.14 kg (0.31 lbs) |
| Dimensions | 110 mm x 66.8 mm x 50 mm (Excluding carrier base) |
| Operating Temp | 0 to 30 deg C (Without derating) |
| Power Consumption | 90 mA maximum @ 5 VDC (Backplane current draw) |
| Module ID | 80088008 |
| Number of Channels | 32 Discrete Outputs (2 groups of 16 channels) |
| Output Type | Sourcing / Positive Logic |
| Nominal Output Voltage | 12/24 VDC |
| Output Voltage Range | 10.2 to 30 VDC |
| Load Current per Point | 0.5 A per channel |
| Maximum Inrush Current | 2.0 A for 100 ms |
| Response Time | ON: 0.2 ms max; OFF: 1.0 ms max |
| Isolation | 250 VAC continuous group-to-group (1500 VAC for 1 min) |
| External Power Supply | 10.2 to 30 VDC (12/24 VDC nominal) |
| Internal Fuses | None |
| Status Indicators | 32 Channel LEDs, OK LED, FLD PWR LED |
The IC200MDL750 communicates across the VersaMax backplane bus, drawing 90 mA from the 5 VDC logic rail to support high density discrete I/O execution. Integrating directly into Profinet or EtherNet/IP deterministic network drops, the hardware syncs frame updates to the physical driver stages without backplane bus latency. Scalable carrier base mounting options ensure strict firmware flash compatibility verification via native Module ID mechanisms, enabling hot-swap capabilities during active operation without disturbing power delivery to adjacent system racks.
Q: Does the IC200MDL750 feature internal fuses to mitigate channel overload conditions?
A: No. The IC200MDL750 contains no internal fuses. External current-limiting devices or external inline fuses must be installed on field output loops to protect module output transistors against direct short circuits.
Q: How does ambient temperature and mounting orientation affect module output channel density?
A: To operate all 32 output channels at maximum rated current (0.5 A per point) without thermal derating, the ambient operating temperature must be maintained between 0 and 30 deg C. Higher temperatures or vertical DIN rail mounting configurations require channel derating based on hardware manual guidelines.
Q: Is an external suppression network required for driving inductive loads?
A: Yes. Inductive field loads (such as solenoid coils or contactors) require external transient suppression circuits (such as flyback diodes or RC networks) connected directly across the load terminals to prevent inductive kickback damage to output points.
Power Safety Isolation: Disconnect main power to the cabinet and isolate all external 24 VDC field power supplies prior to mounting, wiring, or servicing the module.
Carrier Assembly: Align the module with the guide rails of the VersaMax I/O carrier base and press firmly down until side latch mechanisms engage securely. Mount the base on a standard 35 mm DIN rail.
Field Wiring Connections: Wire the external 10.2 to 30 VDC power supply to the designated DC+ and DC- bus terminals on each group terminal block. Ensure all 16 output channels per group are referenced to the correct group common.
Inductive Suppression Setup: Place external transient suppression devices across every inductive load to prevent voltage transients from back-feeding into the channel drivers.
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